Seagate Technology Incorporated

Speedfam-ipec Corporation

General Electric Company

Mark S Maggio

Steven S Eckerd

David S Allsup

Loren D Skarky

Tom Metzner

Alvin E Cox

James L Farmer

Michael D Smigel

Randy McNurlin

Yoshiki Midori

Ann Wilkey

Shawn Robertson

Cal Hardie

Kevin Matthew Durocher

David Joseph Andrews

Ray-Chung Yu

Min Yuan

Ray Yu

Various methods and systems are provided for forming a flexible circuit. In one example, a method includes forming a flexible circuit comprising a plurality of contact pads arranged into a plurality of rows, each contact pad of a given row electrically coupled to one another via electrical traces and each contact pad including a via, electroplating the flexible circuit, including electroplating each via, with at least a first material, and upon confirming connectivity of each via, cutting at least some of the electrical traces at least partially.

Methods and systems for a flexible circuit

A two sided wafer handling end-effector provides for the efficient loading and unloading of wafers into and out of a wafer processing apparatus. Each side of the end-effector includes spaced apart rotatable catch mechanisms between which a wafer is firmly grasped. When the end-effector is positioned beneath the wafer processing apparatus the catch mechanisms are rotated to an open position and a lifting surface on the catch mechanisms lifts the wafer into the wafer processing apparatus. When the catch mechanisms are in the open position the wafer is centered on the end-effector by rotatable rocker assemblies that contact the edge of the wafer. As the end-effector is raised into contact with the processing apparatus, the rocker assemblies rotate to a lowered position in the end-effector while arcuate surfaces on the assemblies maintain contact with the wafer edge.

Workpiece handling end-effector and a method for processing workpieces using a workpiece handling end-effector

A two sided wafer handling end-effector provides for the efficient loading and unloading of wafers into and out of a wafer processing apparatus. Each side of the end-effector includes spaced apart rotatable catch mechanisms between which a wafer is firmly grasped. When the end-effector is positioned beneath the wafer processing apparatus, the catch mechanisms are rotated to an open position and a lifting surface on the catch mechanisms lifts the wafer into the wafer processing apparatus. When the catch mechanisms are in the open position, the wafer is centered on the end-effector by rotatable rocker assemblies that contact the edge of the wafer. As the end-effector is raised into contact with the processing apparatus, the rocker assemblies rotate to a lowered position in the end-effector while arcuate surfaces on the assemblies maintain contact with the wafer edge.

A transducer signal terminator for providing electrical connections between a plurality of read/write transducer lead wires and a preamplifier includes a substrate having a plurality of layers and has a plurality of intermediate strips. A plurality of head pads are located on the substrate to provide interconnection points. The intermediate strips have a plurality of electrically conductive pads with a hole therein, and each lead wire is electrically attached to a pad on the intermediate strip. Each intermediate strip is placed on the substrate such that each of the holes in the electrically conductive pads is aligned with one of the head pads on the substrate. An electrical connection is then formed between each head pad and a corresponding conductive pad of the intermediate strip.

Transducer signal wire termination

A low particulating circuit board for a disc drive flex assembly, and a method for forming the same, are disclosed. The circuit board comprises a conductive metal substrate which has sufficient thickness to provide mechanical support and backplane suppression for the circuit board and to efficiently sink heat generated by preamplifier circuitry housed by the circuit board. The substrate has dielectric layers formed on the top and bottom surfaces thereof, the dielectric layers comprising an epoxy interleaved with nonparticulating fibers, such as tetrafluorethylene (TFE) fibers. Traces and pads are provided on the dielectric layers to provide the necessary electrical connections for the preamplifier circuitry. A plurality of circuit boards are formed from a panel and subsequently cut therefrom. Particulate generation is minimized through the use of the metal substrate, as well as recession of the substrate and the solder masks to reduce the amount of material cut during the cutting operation.

Disc drive flex assembly having a low particulating circuit board

Method and apparatus for an improved insulating wire guide for a disc drive actuator assembly. The insulating wire guide is integrally formed with an actuator arm and comprises a rigid, non-conductive material formed onto the actuator arm, the wire guide having a base portion on which head wires rest and tabs extending from the base portion to form a channel through which the head wires are routed. The wire guide and actuator arm are formed from an extrusion having a cross-sectional shape substantially that of the actuator arm, the extrusion including dams forming a channel along one side of the extrusion. The non-conductive material is applied to the extrusion, substantially filling the channel, and, after the non-conductive material is cured, the extrusion and the cured non-conductive material is machined to provide the desired configuration of the actuator arm and the wire guide.

Insulated wire guides for an actuator assembly

An apparatus connects a flexible circuit to an actuator arm of a disc drive. The actuator arm supports a transducer head assembly, and the flexible circuit includes an electrical circuit supporting structure supporting a first electrical circuit coupled to the transducing head assembly. The apparatus comprises a solder joint. In one embodiment, the solder joint comprises a pin, respective first and second pin receiving holes in the actuator arm and supporting structure, and a solder connection between the pin and the supporting structure. Connecting the flexible circuit to the actuator arm entails inserting the pin through the second pin receiving hole, press-fitting the pin into the first pin receiving hole, and soldering it to the supporting structure. Another embodiment includes a solder connection between a ground plane on the supporting structure and the pin.

Apparatus connecting a flexible circuit to an actuator arm of a disc

Method of electrically connecting a transducer to a preamplifier

A transducer signal terminator for providing electrical connections between a plurality of read/write transducer lead wires and a preamplifier includes a substrate having a plurality of layers and has a plurality of intermediate strips attached to the substrate. A plurality of head pads are located on the substrate to provide interconnection points between the lead wires and the substrate. Each intermediate strip is placed on the substrate such that each of a plurality of holes therein is aligned with one of the head pads on the substrate. An electrical connection is then formed between each head pad and a corresponding conductive pad of the intermediate strip.

Growing community of inventors

Bethany, OK, United States of America

Mark S Maggio