Raytheon Company

Aspen Aerogels, Inc.

Mark S Hauhe

Clifton Quan

Tse E Wong

Rohn Sauer

Samuel Doug Tonomura

Timothy E Dearden

Stephen E Sox

Polwin C Chan

George Leighton Gould

Stan W Livingston

Fangchou Yang

Jason G Milne

Gerald A Cox

Kevin C Rolston

Terry C Cisco

Richard D Young

Mark E Stading

Chaim Warzman

Yanmin Zhang

Adam C Von

Harold S Fenger

Paul Nahass

Colleen Tallman

Anita L Reinehr

Gregg M Tanakaya

Jim Vaught

Sean Costello

Nick Zafiropoulos

Nick Zafiropoulous

Anita Reinehr

A circuit board assembly includes a circuit board, a chip attached to the circuit board and a dielectric layer. The chip has a circuit facing the circuit board and spaced from it. The dielectric layer includes an aerogel. In one embodiment, the aerogel has a dielectric constant of approximately 2.0 or less and a compression strength of at least approximately 100 psi.

Aerogel dielectric layer

A switchable microwave fluidic polarizer is provided. In one embodiment, the invention relates to a switchable polarizer for polarizing radio frequency (RF) signals associated with an antenna, the switchable polarizer including a plurality of radiating elements, an RF feed coupled to the plurality of radiating elements, an antenna input coupled to the RF feed, and an antenna cover disposed in proximity to the plurality of radiating elements, the antenna cover including a dielectric substrate including a plurality of channels for enclosing a liquid metal.

Switchable microwave fluidic polarizer

Systems and methods for providing a reconfigurable groundplane are provided. In one embodiment, the invention relates to an antenna assembly having a reconfigurable groundplane, the assembly including a radio frequency (RF) feed, a plurality of radiating elements, a plurality of interconnects, each coupling one of the plurality of radiating elements to the RF feed, a first groundplane positioned between the RF feed and the plurality of radiating elements, a second groundplane positioned between the RF feed and the plurality of radiating elements, the second groundplane including at least one cavity for enclosing a liquid metal.

Systems and methods for providing a reconfigurable groundplane

A light weight stowable antenna lens array assembly is provided. In one embodiment, the invention relates to a stowable lens antenna array including at least one antenna pair including a transmit antenna on a first layered composite, a receive antenna on a second layered composite, a ground plane on a third layered composite, the ground plane being between and spaced apart from the transmit antenna and the receive antenna, and a balanced transmission line coupling the transmit antenna to the receive antenna, and an articulating structure attached to at least one of the first layered composite, the second layered composite and the third layered composite, the articulating structure having a collapsed configuration and an expanded configuration, wherein at least one of the first layered composite, the second layered composite and the third layered composite includes a polymeric film.

Light weight stowable phased array lens antenna assembly

A distributed control system for an active array antenna system is disclosed. In an exemplary embodiment, the array system employs many transmit/receive (T/R) modules each with an associated radiator element, a phase shifter element and a set of RF switch elements to set the module to transmit or receive modes. The array system is arranged to generate a transmit or receive array beam. The distributed control system in an exemplary embodiment includes an array processor for controlling the array, the processor configured to generate command signals to set the T/R module elements to transmit or receive mode and to steer the array beam to a desired direction. The command signals to steer the array beam include phase slopes common to all T/R modules in a given array or subarray. Each T/R module includes a beam steering control function configured to convert the phase slope data to phase data to set the phase shifter element for that T/R module to a phase shift setting for the beam direction associated with the phase slope index data.

Transmit/receive module communication and control architechture for active array

A switchable 0&#xb0;/180&#xb0; phase shifter on a balanced transmission line is provided. In one embodiment, the invention relates to an apparatus for providing 0&#xb0;/180&#xb0; phase shifting for a transmit/receive antenna pair including a transmit element and a receive element coupled by a balanced transmission line having two sections, the apparatus including a first section of the balanced transmission line, the first section including a first conductor and a second conductor, a second section of the balanced transmission line, the second section including a third conductor and a fourth conductor, and a switch disposed between the first section and the second section, wherein in a first configuration, the switch couples the first conductor to the third conductor and the second conductor to the fourth conductor, and in a second configuration, the switch couples the first conductor to the fourth conductor and the second conductor to the third conductor.

Flexible transmit/receive antenna pair using a switchable 0&#xb0;/180&#xb0; phase shifter

A reconfigurable fluidic shutter for selectively shielding an antenna array includes a first surface and second surface spaced apart and defining a cavity; and a pump configured to pump liquid that attenuates electromagnetic radiation, such as a liquefied metal or alloy composition, into and out of the cavity. The first and second surface are transparent to electromagnetic radiation, for instance, microwave or other RF radiation.

Reconfigurable fluidic shutter for selectively shielding an antenna array

In one or more embodiments, a method of producing a stacked integrated circuit assembly includes providing a substrate having a top surface with at least one substrate connection pad. A first flip chip integrated circuit (FFIC) is disposed above the substrate, and a second flip chip integrated circuit (SFIC) is disposed above the FFIC. The FFIC may be disposed between the substrate and the SFIC. The method includes making at least one solder connection between the substrate connection pad and the FFIC and at least one solder connection between the FFIC and the SFIC.

Stacked integrated circuit assembly

A stacked integrated circuit assembly includes a substrate having a top surface with at least one substrate connection pad. A first flip chip integrated circuit (FFIC) is disposed above the substrate, and a second flip chip integrated circuit (SFIC) is disposed above the FFIC. The FFIC is disposed between the substrate and the SFIC. The stacked integrated circuit assembly includes least one solder connection between the substrate connection pad and the FFIC and at least one solder connection between the FFIC and the SFIC.

An antenna array includes a folded thin flexible circuit board with a thin dielectric layer and a conductor layer pattern formed on a first surface of the dielectric layer. The circuit board may be folded in a plurality of folds to form a pleated structure. An array of radiator structures is formed on the first surface, A conductor trace pattern is formed on the folded circuit board. A plurality of active RF circuit devices is attached to the folded circuit board in signal communication with the conductor trace pattern.

Antenna array

An antenna array is assembled by direct attaching a flip chip transmit/receive (T/R) module to an antenna circuit board. A fillet bond is applied to the circuit board and the flip chip T/R module around at least a portion of the periphery of the flip chip T/R module.

Circuit board assembly and method of attaching a chip to a circuit board with a fillet bond not covering RF traces

A foldable radiator assembly includes a flexible dielectric substrate structure having a radiator conductor pattern formed therein. The flexible substrate structure can be flexible for movement between a folded position and a deployed position, or can be fixed in position by dielectric structures. An excitation circuit excites the radiator conductor pattern with RF energy. Strips of the radiator assemblies can be used to form an array aperture.

Growing community of inventors

Hermosa, CA, United States of America

Mark S Hauhe