Honeywell International Inc.

Honeywell G.m.b.h.

Maxim Integrated Products, Inc.

Other

Mark Robert Plagens

Urs H Mader

Bryan Andrew Mueller

Erik S Wheeler

Michael James Haji-Sheikh

Richard Alan Davis

Carl Stewart

Uppili Sridhar

James D Cook

Gilberto Morales

D Joseph Maurer

Walter T Matzen

Richard A Kirkpatrick, Ii

Robert Kryzanowski

Brian Fritz

Albert W Drabowicz

An integrated standard-compliant data acquisition device includes an electrically insulating package including a plurality of conductive leads and an integrated circuit (IC) disposed within the electrically insulating package and electrically coupled to at least some of the plurality of conductive leads. The IC includes a first multiplexer (MUX), a second MUX, a third MUX, an analog-to-digital converter (ADC), a plurality of registers, a fourth MUX, control logic, and communication circuitry. In operation, a first circuit value under a first condition can be determined and stored, a second circuit value under a second condition can be determined and stored, and the decision as to whether there is a fault condition can be mad by comparing the first circuit value and the second circuit value.

Integrated standard-compliant data acquisition device

A differential communication system includes a first differential communication device including a differential transmitter, a second differential communication device including a differential receiver, and a differential isolator coupling the differential transmitter to the differential receiver. The differential receiver includes a comparator operative to develop waveform region information from the received waveform, a filter adapted to remove noise from the received waveform using the waveform region information, and an adaptive sampler adapted to adjust a received waveform sampling point after it has been filtered.

Method and apparatus for differential communications

A method of detecting a ground fault condition between a direct current power system and the chassis ground of an electric or hybrid-electric vehicle is provided. The method includes sequentially opening and closing a first switch connected between a positive node of the direct current power system and the chassis ground of the vehicle and a second switch connected between a negative node of direct current power system and the chassis ground. The sequential opening and closing of the first and second switches charges and discharges an inherent capacitance present between the metal components of the direct current power system and the chassis. First and second currents are created as the inherent capacitance is charged and discharged. Measurements of the created first and second currents are then used to determine whether a ground fault condition exists between the direct current power system and the vehicle chassis ground.

Fault detection method for detecting leakage paths between power sources and chassis

The ring magnet speed and direction sensing scheme according to the present invention addresses many of the shortcomings of the prior art. In accordance with various aspects of the present invention, a pair of bridges placed on the same semiconductor chip are provided for sensing the passing of north/south transition points on a ring magnet. In accordance with an exemplary embodiment, the bridge contains a first group of runners that are perpendicular to a second group of runners. The bridges are placed to cause the signal from one bridge to slightly follow the signal from the other bridge. Placement of the bridges on the same chip enables highly accurate readings.

Magnetoresistive speed and direction sensing method and apparatus

A sensor having freeze resistant features is disclosed. The sensor includes a sensor die and a buffer member that are assembled for attachment to a process fluid conduit. The buffer member defines an opening in fluid communication with the process fluid. The sensor die has a flexible diaphragm, and a capillary channel establishes fluid communication between the diaphragm area of the sensor die and the opening in the buffer member.

Freeze resistant sensor

A Hall-effect element includes an isolating layer and an active layer of a first electrical conductivity type disposed on the isolating layer, the active layer having a surface. A first set of contacts is disposed in contact with the surface along a first axis, and a second set of contacts is disposed in contact with the surface along a second axis transverse to the first axis. An insulating layer is disposed on the surface. A metal control field plate is disposed on the insulating layer and is coupleable to a voltage source to control the accumulation of charge carriers at the surface of the active layer to vary the resistance of the active layer. Also, a method is provided for reducing null offset in a Hall-effect element. The method includes the steps of providing an isolating layer, disposing an active layer of a first electrical conductivity type on the isolating layer, the active layer having a surface, disposing a first set of contacts on the surface along a first axis, disposing a second set of contacts on the surface along a second axis transverse to the first axis; and disposing an insulating layer on the surface. A voltage is applied across the insulating layer to control the accumulation of charge carriers at the surface to vary the resistance of the active layer.

Hall-effect element with integrated offset control and method for operating hall-effect element to reduce null offset

A sensor with a dynamic latch comprising having a sensor coupled to a gain amplifier, a delay circuit connected to the gain amplifier and a summing circuit coupled through first and second nodes to the gain amplifier. The sensor with a dynamic latch further comprises an output stage coupled to a comparator circuit and the summing circuit and to third and fourth nodes and first and second energy storing devices coupled to the comparator circuit.

Sensor with a dynamic latch

Sensor with dynamic latch

A current regulator is provided for a two wire sensor and comprises first and second conductors arranged to provide a sensor output current, a first resistance and a current reference coupled across the first and second conductors, and a second resistance and sensor load terminals coupled across the first and second conductors. An amplifier has first and second inputs and an output. The first input is coupled to a first junction between the first resistance and the current reference, the second input is coupled to a second junction between the second resistance and the sensor load terminals, and the output is connected to the second input. The amplifier controls a first voltage at the first junction to be substantially equal to a second voltage at the second junction.

Supply current regulator for two-wire sensors

A magnetic sensor circuit provides current sources that create a feedback loop for an amplifier of one magnetically sensitive component in order to maintain the sensor output and the corresponding amplifier input at a first preselected magnitude which can be generally equal to zero. The other current source maintains a generally identical current as a reference against which the output of another magnetically sensitive component is compared. The magnetically sensitive components can be Hall effect elements, indium antimonide sensors or magnetoresistive elements. The output of the circuit is representative of the difference between the magnetic field intensities imposed on the first and second magnetically sensitive components.

Magnetic sensor circuit with two magnetically sensitive devices

A pressure sensor is provided in which the pressure sensing components are isolated from a portion of an attached buffer member which is connected to a fluid conduit. The offset characteristic of the pressure sensor isolates stress from being transmitted between an attached external fluid conduit and the sensitive components of the pressure sensor. One embodiment of the pressure sensor solders a fluid conduit structure to a buffer member that is attached to a pressure sensor die. An alternative embodiment of the present invention avoids the need for making solder connections between the sensor structure and external components by utilizing elastomeric conductors and pressure seals in association with the pressure sensor composite structure and first and second housing structures. These elastomeric conductors also provide improved stress isolation. The housing structures are used to compress to the seal and the elastomeric conductor against selected portions of the composite sensor.

Offset pressure sensor

A method is provided for assuring good electrical contact between a power supply and appropriate regions of silicon wafers to assure proper etching during the micromachining of the silicon die locations on the wafer. A plurality of conductors are disposed in the interstices between rows and columns of die locations and each die location that is to be etched is provided with a conductive extension connecting its relevant region with one of the interstice conductors. A preselected number of die locations are dedicated to the purpose of providing conductive pads against which contacts of a power supply can be disposed. The many interconnections between the row interstice conductors and the column interstice conductors assures good electrical distribution across the entire surface of a first side of the wafer.

Method for etching silicon

A resistor formed in the same epitaxial layer of semiconductor material in which a Hall element is formed is used to provide a temperature dependent voltage source which is inversely proportional to the resistance of a temperature sensitive load resistor on the Hall element output. A current mirror circuit is used to apply a current proportional to the current through the epitaxial layer resistor to the load resistor so that the voltage across through the load resistor varies in a direct relationship with the sensitivity of the Hall element.

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Richardson, TX, United States of America

Mark Robert Plagens