Applied Materials, Inc.

Mark Robert Denome

Yezdi N Dordi

Michael N Sugarman

Donald J Olgado

Joseph Stevens

Robin W Cheung

Avi Tepman

Ashok K Sinha

Ratson Morad

Dan A Marohl

Ho Seon Shin

Peter W Hey

Dan Carl

George Birkmaier

Eugene Ravinovich

Kartik Bhupendra Shah

Ashish Kumar

Prashanth Kothnur

Allen L D'Ambra

Umesh M Kelkar

Ala Moradian

Vijayakumar C Venugopal

Karthik Ramanathan

Joe Stevens

Elizabeth Neville

H Peter W Hey

Yevgeniy Rabinovich

Orlando Trejo

Mark Lloyd

Sergey Meirovich

Sandy S Chao

Bob Lowrance

Ching-Hong Hsieh

Vijai Thangamany

Roy Edwards

Donald J K Olgado

Bernardo Donoso

Somil Kapadia

Somil Kapdia

Anna Marie Lloyd, Legal Representative

A first selection of a first fabrication process and/or first manufacturing equipment to perform manufacturing operations of the first fabrication process is received. The first selection is input into a digital replica of the first manufacturing equipment, where the digital replica outputs physical conditions of the first fabrication process. Environmental resource usage data indicative of a first environmental resource consumption of the first fabrication process run on the first manufacturing equipment based on the physical conditions of the first fabrication process is determined. A modification to the first fabrication process that reduces the environmental resource consumption of the first fabrication process run on the first manufacturing equipment is determined. Applying the modification to the first fabrication and/or providing the modification for display by a graphical user interface (GUI) is performed.

Eco-efficiency (sustainability) dashboard for semiconductor manufacturing

A method including receiving, by a processing device, a first selection of at least one of a first fabrication process or first manufacturing equipment to perform manufacturing operations of the first fabrication process. The method can further include inputting the first selection into a digital replica of the first manufacturing equipment wherein the digital replica outputs physical conditions of the first fabrication process. The method may further include determining environmental resource usage data indicative of a first environmental resource consumption of the first fabrication process run on the first manufacturing equipment based on the physical conditions of the first fabrication process. The processing device may further determine a modification to the first fabrication process that reduces the environmental resource consumption of the first fabrication process run on the first manufacturing equipment. The method can further include performing at least one of applying the modification to the first fabrication.

A method includes determining, by a processing device, a first eco-efficiency characterization associated with a first design of manufacturing equipment based on one or more of water eco-efficiency characterization, emissions eco-efficiency characterization, or electrical energy eco-efficiency characterization. The water eco-efficiency characterization, the emissions eco-efficiency characterization, the electrical energy eco-efficiency characterization, and the first eco-efficiency characterization are associated with an amount of environmental impact generated by the manufacturing equipment per unit product produced by the manufacturing equipment. The method further includes comparing the first eco-efficiency characterization to a second eco-efficiency characterization that is associated with a second design of the manufacturing equipment. The method further includes implementing the second design of the manufacturing equipment responsive to determining, based on the comparing, that the second eco-efficiency characterization is associated with a lower amount of environmental impact per unit product than the first eco-efficiency characterization.

Eco-efficiency characterization tool

A method for wafer point by point analysis includes receiving a selection of manufacturing equipment, utility use data, and utilization data. A water eco-efficiency characterization is calculated based on the utilization data and the utility use data. An emissions eco-efficiency characterization is calculated based on the utilization data and the utility use data. An electrical energy eco-efficiency characterization is calculated based on the utilization data and the utility use data. A combined eco-efficiency characterization is calculated based on the utilization data and water eco-efficiency characterization, emissions eco-efficiency characterization, and electrical energy eco-efficiency characterizations. The combined eco-efficiency characterization is provided for display by a graphical user interface.

The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. Preferably, the electro-chemical deposition system includes a spin-rinse-dry (SRD) station disposed between the loading station and the mainframe, a rapid thermal anneal chamber attached to the loading station, and a system controller for controlling the electro-chemical deposition process and the components of the electro-chemical deposition system.

Electro-chemical deposition system

A system is provided in which a smaller flow of deposition solution is diverted from a larger flow of deposition solution flowing on an electrochemical deposition tool platform. The smaller flow is diverted to a dosing unit which may be on a separate platform. The dosing unit in one embodiment comprises a pressurized flow line.

Apparatus for electro chemical deposition

A method and associated apparatus for electro-chemically depositing a metal film on a substrate having a metal seed layer. The apparatus comprises a substrate holder that holds the substrate. The electrolyte cell receives the substrate in a processing position. The actuator is connected to the substrate holder and adjustably positions the substrate relative to the electrolyte cell. The method involves electro-chemically depositing a metal film on a substrate having a metal seed layer comprising disposing the substrate in an electrolyte cell that is configured to receive the substrate. The method comprises adjustably positioning the substrate relative to the electrolyte cell.

Deposition uniformity control for electroplating apparatus, and associated method

An apparatus and method for electro-chemically depositing a uniform metal layer onto a substrate is provided. In one aspect, the apparatus includes a cathode connected to the substrate plating surface, an anode disposed above the substrate support member and an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface. In another aspect, the apparatus further includes a dual catch-cup system having an electroplating solution catch-cup and a rinse catch-cup. The dual catch-cup system provides separation of the electroplating solution and the rinse solutions during processing and provides re-circulating systems for the different solutions of the electroplating system.

Electro-chemical deposition cell for face-up processing of single semiconductor substrates

A method and apparatus for processing a substrate is described. In one aspect, a processing system is provided which includes a wet area and a dry area. In another aspect, a method comprises processing the substrate in the process cell. The substrate is transferred from the process cell to a dry module and then transferring the substrate to a drying area.

Segmenting of processing system into wet and dry areas

In one aspect, a vacuum chuck supports a substrate on an end effector, the vacuum chuck comprising a position reference structure and a suction cup. The position reference structure is mounted to the surface and comprises a reference surface. The suction cup is located proximate the reference surface and comprising a suction mount. In another aspect, a method of chucking a substrate to a vacuum chuck is provided. The vacuum chuck comprises a suction cup and a position reference structure. The method comprises attaching the suction cup to the substrate to form a seal therebetween. The suction cup is deformed such that the substrate contacts the position reference structure. The substrate is then leveled on the position reference structure.

Self positioning vacuum chuck

A system is provided in which a smaller flow of deposition solution is diverted from a larger flow of deposition solution flowing on an electro-chemical deposition tool platform. The smaller flow is diverted to a dosing unit which may be on a separate platform. The dosing unit in one embodiment comprises a pressurized flow line.

Apparatus and method for electro chemical deposition

The invention provides an electro-chemical deposition cell for face-up processing of semiconductor substrates comprising a substrate support member, a cathode connected to the substrate plating surface, an anode disposed above the substrate support member and an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface. Preferably, the anode comprises a consumable metal source disposed in a liquid permeable structure, and the anode and a cavity ring define a cavity for holding and distributing the electroplating solution to the substrate plating surface. Preferably, the substrate support member comprises a vacuum chuck having vacuum ports disposed on the substrate supporting surface that serves to provide suction during processing and to provide a blow-off gas flow to prevent backside contamination during substrate transfers. The substrate support member also rotates and vibrates during processing to enhance the electro-deposition onto the substrate plating surface.

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Sunnyvale, CA, United States of America

Mark Robert Denome