Corning Incorporated

Mark Ranney Westcott

Garrett Andrew Piech

Paul Francis Michaloski

Alranzo Boh Ruffin

Mark Christian Sanson

Todd Robert McMichael

Lovell Eglin Comstock, Ii

Thien An Thi Nguyen

Michael Morgan Dunn

Jaques Gollier

Michael Peter Gaj

A compound lens assembly and method for making a compound lens assembly useful for deep ultraviolet lithography are described. The compound lens assembly includes a first lens component having an optical surface bonded to an optical surface of a second lens component. The bonding at the interface can be achieved using a hydroxide catalysis bonding technique. The compound lens assembly and process for making same solve problems relating to constringence and/or inherent birefringence known for conventional optical elements used in deep ultraviolet lithography or inspection of wafers or reticles in the DUV.

Hydroxide-catalysis bonding of optical components used in DUV optical systems

A method of laser processing a workpiece includes: focusing a pulsed laser beam into a laser beam focal line directed into the workpiece such that the laser beam focal line generates an induced absorption and produces a defect line along the laser beam focal line within the workpiece. The laser beam focal line has length L and a substantially uniform intensity profile such that the peak intensity distribution over at least 85% of the length L of the focal line does not vary by more 40%, and in some embodiments by no more than 30 or 20% from its mean peak intensity.

Laser cutting of materials with intensity mapping optical system

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Rochester, NY, United States of America

Mark Ranney Westcott