International Business Machines Corporation

Mark R Kordus

Louis H Wirtz

Mark S Schneider

Lester W Herron

John Acocella

Emanuel Israel Cooper

Carlos Juan Sambucetti

Ravi F Saraf

Steven Paul Ostrander

Judith Marie Roldan

Richard B Booth

Sol Krongelb

Edward A Giess

The present invention is directed to a process of a method for the full metallization of thru-holes in a polymer structure comprising the steps of applying a film-forming amount of a conductive polymer-metal composite paste to a metal cathode; bonding a patterned polymer structure to said paste; subjecting said polymer structure to an electrolytic plating bath for a time sufficient to fully metallize thru-hole surfaces in said patterned polymer structure and removing the structure from the cathode assembly. The fully metallized thru-hole polymer structure can then be cleaned and polished to produce a finished product.

Fabrication of double side fully metallized plated thru-holes, in

The present invention relates generally to new structures for decals, and more particularly to electrically conductive decals filled with inorganic insulator material. Various methods and processes that are used to make these electrically conductive decals filled with inorganic dielectric material are disclosed.

Structures for electrically conductive decals filled with inorganic

The present invention relates generally to new decal structures, and more particularly to electrically conductive decals that are filled with organic insulator material. Various methods and processes that are used to make these electrically conductive decals filled with organic dielectric materials are disclosed.

Structures for electrically conductive decals filled with organic

The present invention relates generally to new processes for making decals, and more particularly to electrically conductive decals that are filled with organic insulator material. Various methods and processes that are used to make these electrically conductive decals filled with organic dielectric materials are disclosed.

Processes for electrically conductive decals filled with organic

The present invention relates generally to new processes for making decals, and more particularly to electrically conductive decals filled with inorganic insulator material. Various methods and processes that are used to make these electrically conductive decals filled with inorganic dielectric material are disclosed.

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Pleasant Valley, NY, United States of America

Mark R Kordus