Hewlett Packard Enterprise Development LP

Mark R Fernandez

Michael Scott

Eng Lim Goh

Bret M Cuda

David Petersen

John Kichury

Robert Behringer

Calandra Szulgit

Example containers are provided to retain and cool electronic devices in environments where power and/or coolant (e.g., airflow) is limited or finite. In examples, a container can include a housing and a conduit system. The housing can include a plurality of sides including a front side and a back side, and can be structured to retain at least a first computing device. In addition, the housing can provide for a first and second inlet opening and a first and second outlet opening on the back side of the container. The conduit system can be provided within the housing to guide the airflow received from each of the first and second outlet openings through an interior volume of the container to cause the airflow to exit from each of the first and second outlet openings. Further, the conduit system can include a plurality of structures that combine to guide at least a portion of the airflow received through the first and second inlet openings through a top region of the interior volume as the airflow is moved from the back side of the container to the front side of the container. Further still, the conduit system can guide at least a portion of the warmed airflow to a bottom region of the interior volume as the warmed airflow is moved from the front side to the back side of the container.

Cooling container

Growing community of inventors

Greer, SC, United States of America

Mark R Fernandez