Medtronic, Inc.

Other

Covidien LP

Mark R Boone

Randolph E Crutchfield

Lonny V Cabelka

Mohsen Askarinya

Marshall J Rasmussen

Mark E Henschel

Kevin Patrick Kuehn

Lejun Wang

John T Meador

Juan G Milla

Joachim Hossick-Schott

Andreas A Fenner

Chunho Kim

Mark S Ricotta

Craig L Schmidt

Jonathan L Kuhn

Randal C Schulhauser

John Daniel Norton

David Probst

Kenneth Heames

Avram Scheiner

Yong Kyun Cho

Saul E Greenhut

Jonathon E Giftakis

Shantanu Sarkar

Eric J Panken

David A Anderson

John Wainwright

Michael D Eggen

Michael F Mattes

Richard J O'Brien

Kathryn Hilpisch

Kamal Deep Mothilal

Larry Earl Tyler

Paul F Gerrish

Forrest C M Pape

Lary R Larson

Ralph B Danzl

George D Jones

Frank V Resso

Nathalie Virag

Tyler Mueller

Matthew L Plante

Erik J Herrmann

Ekaterina M Ippolito

Joseph M Orlando

Scott DeFoe

John P Keane

Kathryn Ann Milbrandt

Laura M Zimmerman

Matthew A Joyce

Stanley J Taraszewski

Kenneth A Timmerman

Ning Yu

Amruta Paritosh Dixit

Bruce Boss

Jeff Van Wagoner

This disclosure is directed to systems and techniques for detecting change in patient health based upon patient data. In one example, a medical system comprising processing circuitry communicably coupled to a glucose sensor and configured to generate continuous glucose sensor measurements of a patient. The processing circuitry is further configured to: extract at least one feature from the continuous glucose sensor measurements over at least one time period, wherein the at least one feature comprises one or more of an amount of time within a pre-determined glucose level range, a number of hypoglycemia events, a number of hyperglycemia events, or one or more statistical metrics corresponding to the continuous glucose sensor measurements; apply a machine learning model to the at least one extracted feature to produce data indicative of a risk of a cardiovascular event; and generate output data based on the risk of the cardiovascular event.

Detection of changes in patient health based on glucose data

A system comprises a sensor device and processing circuitry. The sensor device comprises a housing configured to be disposed above shoulders of a patient, a plurality of electrodes on the housing, a motion sensor, and sensing circuitry configured to sense a brain electrical signal and a cardiac electrical signal via the electrodes, and a motion signal via the motion sensor. The processing circuitry is configured to determine values over time of one or more parameters from the brain electrical signal, determine values over time of one or more parameters from the cardiac electrical signal, and generate at least one of a detection, prediction, or a classification a condition of the patient based on the values and the motion signal.

Detection of patient conditions using signals sensed on or near the head

An example medical device includes an optical sensor, processing circuitry, an antenna, and a power source. The optical sensor includes a light source; a reference optical beacon having a first fluorophore that emits a first fluorescence proportional to a first concentration of a substance proximate the beacon; a test optical beacon having a reagent substrate that reacts with an analyte to produce the substance and a second fluorophore that emits a second fluorescence proportional to a second concentration of the substance proximate the test beacon; and a photodetector to detect the first and second fluorescence. The processing circuitry determines a difference between the first and second fluorescence, which is indicative of the concentration of the analyte. The antenna and power source enable the medical device to operate completely within a biological system for continuous analyte monitoring.

Optical based glucose sensor

Various embodiments of an electrical component and a method of forming such component are disclosed. The electrical component includes a substrate having a first major surface, a second major surface, and cavity disposed in the substrate. The cavity extends between the first major surface and a recessed surface. Tantalum material is disposed within the cavity. Further, the tantalum material includes tantalum particles. The electrical component also includes a dielectric layer disposed on the tantalum particles and an electrolyte cathode layer disposed on the dielectric layer. The electrical component further includes a cathode electrode disposed on the electrolyte cathode layer and over the cavity.

Electrical component and method of forming same

The present disclosure provides methods and techniques associated with a planar transformer for an apparatus. The planar transformers include a substrate carrying electronic components and a continuous core that is formed by distributing the encapsulant material uniformly around the substrate unit to define a consistent cross-sectional area for the magnetic path. The electronic components include primary windings and secondary windings associated with the transformer. In some embodiments, the encapsulant material is molded to seals air gaps to the substrate unit.

Method of forming a transformer assembly

Various embodiments of an electrical component and a method of forming such component are disclosed. The electrical component includes a substrate having a first major surface, a second major surface, and a cavity disposed in the substrate. The cavity extends between the first major surface and the second major surface. The electrical component also includes an anode electrode that includes a conductive foil layer disposed on the second major surface of the substrate and over the cavity. Tantalum material is disposed within the cavity and includes tantalum particles. A dielectric layer is disposed on the tantalum particles, and an electrolyte cathode layer is disposed on the dielectric layer. The electrical component also includes a cathode electrode disposed over the cavity.

Various embodiments of an electrical component and a method of forming such component are disclosed. The electrical component includes a substrate having a first major surface, a second major surface, an alloy layer disposed on the first major surface of a substrate, and tantalum material disposed on the alloy layer such that the alloy layer is between the tantalum material and the first major surface of the substrate. The tantalum material includes bonded tantalum particles. The electrical component can also include a dielectric layer disposed on the tantalum particles, a cathode electrode disposed over the tantalum material, and an anode electrode disposed on the second major surface of the substrate.

Various embodiments of an integrated circuit package and a method of forming such package are disclosed. The package includes a substrate having a core layer disposed between a first dielectric layer and a second dielectric layer, a die disposed in a cavity of the core layer, and an encapsulant disposed in the cavity between the die and a sidewall of the cavity. The package further includes a first patterned conductive layer disposed within the first dielectric layer, a device disposed on an outer surface of the first dielectric layer such that the first patterned conductive layer is between the device and the core layer, a second patterned conductive layer disposed within the second dielectric layer, and a conductive pad disposed on an outer surface of the second dielectric layer such that the second patterned conductive layer is between the conductive pad and the core layer.

Integrated circuit package and method of forming same

Various embodiments of a die carrier package and a method of forming such package are disclosed. The package includes one or more dies disposed within a cavity of a carrier substrate, where a first die contact of one or more of the dies is electrically connected to a first die pad disposed on a recessed surface of the cavity, and a second die contact of one or more of the dies is electrically connected to a second die pad also disposed on the recessed surface. The first and second die pads are electrically connected to first and second package contacts respectively. The first and second package contacts are disposed on a first major surface of the carrier substrate adjacent the cavity.

Die carrier package and method of forming same

Various embodiments of a sealed package and a method of forming such package are disclosed. The package includes a housing, a substrate hermetically sealed to the housing, and a light source disposed on a first major surface of the substrate. The package further includes a detector disposed on the first major surface of the substrate and having a detecting surface. The package also includes a masking layer disposed on at least one of the first major surface and a second major surface of the substrate, where the masking layer includes a first aperture aligned with an emission axis of the light source in a direction orthogonal to the first major surface of the substrate. The masking layer further includes a second aperture aligned with a detection axis of the detector in a direction orthogonal to the first major surface of the substrate.

Hermetically-sealed package and method of forming same

Various embodiments of an integrated circuit package and a method of forming such package are disclosed. The integrated circuit package includes first and second active dies. Each of the first and second active dies includes a top contact disposed on the top surface of the die and a bottom contact disposed on a bottom surface of the die. The package further includes a via die having first and second vias that each extends between a top contact disposed on a top surface of the via die and a bottom contact disposed on a bottom surface of the via die, where the bottom contact of the first active die is electrically connected to the bottom contact of the first via of the via die and the bottom contact of the second active die is electrically connected to the bottom contact of the second via of the via die.

Integrated circuit package and system using same

A multi-chip modular wafer level package of a high voltage unit for an implantable cardiac defibrillator includes one or more high voltage (HV) component chips encapsulated with other components thereof in a polymer mold compound of a single reconstituted wafer, wherein all interconnect segments are preferably located on a single side of the wafer. To electrically couple a contact surface of each HV chip, located on a side of the chip opposite the interconnect side of the wafer, the reconstituted wafer may include conductive through polymer vias; alternately, either wire bonds or layers of conductive polymer are formed to couple the aforementioned contact surface to the corresponding interconnect, prior to encapsulation of the HV chips. In some cases one or more of the components encapsulated in the reconstituted wafer of the package are reconstituted chips.

Wafer level packages of high voltage units for implantable medical devices

Growing community of inventors

Gilbert, AZ, United States of America

Mark R Boone