3d Glass Solutions, Inc.

Mark Popovich

Jeff A Bullington

Jeb H Flemming

Roger Cook

Carrie F Schmidt

Luis C Chenoweth

Sierra D Jarrett

Luis Chenoweth

A method of batch massively parallel die release of a die from a substrate enabling low cost mass production of with passive, system in package (SiP) or system-in-a-package, or systems-on-chip (SoC), filters and/or other devices from a glass substrate.

High efficiency die dicing and release

The present invention includes a method of creating electrical air gap or other low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

Method of making a mechanically stabilized radio frequency transmission line device

Growing community of inventors

Placitas, NM, United States of America

Mark Popovich