International Business Machines Corporation

Mark O Neisser

Young-Ho Kim

Thomas M Shaw

George Frederick Walker

Emanuel Israel Cooper

Shaji Farooq

Sarah Huffsmith Knickerbocker

Lawrence D David

Robert Anthony Rita

Harbans S Sachdev

Rao Venkateswara Vallabhaneni

Mark A Takacs

Peter Richard Duncombe

Jae M Park

Richard B Booth

Jungihl Kim

Robert R Shaw

Herbert R Anderson, Jr

Farid Youssif Aoude

Edward A Giess

Friedel Muller-Landau

Jon A Van Hise

James M Brownlow, Deceased

Lars W Liebmann

Christopher P Ausschnitt

Scott Marshall Mansfield

Richard Francis Indyk

Burn J Lin

Christopher Douglas Wait

Francisco J Lamelas

A process and apparatus for dynamically adjusting the exposure dose on a photosensitive coating at a localized area within an exposure field in a step-and-scan lithography system. The process and apparatus form a pattern on a photosensitive substrate, such as used in the integrated circuit manufacturing industry. The exposure dose is adjusted at a localized area by a segmented slit system or an array of light-transmitting pixels located across the exposure field. The slit segments or individual pixels are automatically controlled in response to data obtained regarding the uniformity of the projection optics system or the mask pattern.

Process and apparatus to adjust exposure dose in lithography systems

A method and apparatus for correcting defects in a phase shift mask to be used in photolithography. More specifically, the method of the invention includes creating a second repair mask which contains phase shifters. Regions surrounding the defects on the first mask are made opaque. The design circuitry located in these defective regions is copied onto the second mask. During a second exposure the design circuitry is placed onto the semiconductor wafer. Therefore, this method and apparatus provides an inexpensive solution to a difficult problem.

Simple repair method for phase shifting masks

The preferred embodiment of the present invention is a method of enhancing normally unenhanced features types. Pattern shapes are placed on two or more relatively simple, modified masks instead of using a single mask containing diverse feature types. On these modified masks, (hereinafter 'overlay masks'), all of the features are the type normally enhanced. A composite pattern is printed into photoresist through successive exposure to the overlay masks.

Multi mask method for selective mask feature enhancement

Improved vie-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multi-layer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.

Process for producing ceramic circuit structures having conductive vias

Improved via-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multilayer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.

Via paste compositions and use thereof to form conductive vias in

A process for making a compliant thermally conductive, preferably dielectric, compound that enhances the power dissipation capability of high-powered electrical components such as bipolar VLSI semiconductor chips. The compound has chemically stable thermal conduction and viscosity properties; is not subject to phase separation during use and may be applied in small gaps to maximize thermal conduction. The compound preferably comprises a liquid carrier having thermal filler particles dispersed therein and a coupling agent having a functionality which is reactive with the calcined surface of the thermal filler particles, and a functionality having preferential wetting of the thermal filler particles over self-condensation. Additional additives such as fumed silica and polyisobutylene enhance the phase stability and resistance to thermo-mechanical shear force degradation of the thermally conductive compound encountered during functional usage, e.g., fluctuating power cycles.

Process for making a compliant thermally conductive compound

A compliant thermally conductive, preferably dielectric, compound that enhances the power dissipation capability of high-powered electrical components such as bipolar VLSI semiconductor chips. The compound has chemically stable thermal conduction and viscosity properties; is not subject to phase separation during use and may be applied in small gaps to maximize thermal conduction. The compound preferably comprises a liquid carrier having thermal filler particles dispersed therein and a coupling agent having a functionality which is reactive with the calcined surface of the thermal filler particles, and a functionality having preferential wetting of the thermal filler particles over self-condensation. Additional additives such as fumed silica and polyisobutylene enhance the phase stability and resistance to thermo-mechanical shear force degradation of the thermally conductive compound encountered during functional usage, e.g., fluctuating power cycles.

Compliant thermally conductive compound

Disclosed is a screening paste for covering a selected portion of a metallurgical pattern on a substrate while leaving other metallurgy uncovered. The paste is free of polymers and consists, in one example, of 75-80% of a ceramic particulate (such as alumina), 2-8% amorphous fumed silica and 15-20% of linear alcohol. The linear alcohol serves as a vehicle to deliver the solid particles in the paste. In use, after covering the selected portion of the metallurgical pattern with the paste, the alcohol content therein is expelled by subjecting to vacuum treatment at room temperature or heating to a low temperature below about 275.degree. C. thereby obtaining an inert, dry and crack-free protective coating. Upon evaporation of a new metal layer onto the substrate and removal of the protective coating and new metal layer from everywhere except the uncovered metallurgy, the metallurgical pattern is selectively coated with the new metal.

Screenable paste for use as a barrier layer on a substrate during

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Wappingers Falls, NY, United States of America

Mark O Neisser