Flir Systems, Incorporated

Teledyne Flir, LLC

Mark Nussmeier

Eric A Kurth

Theodore R Hoelter

Pierre M Boulanger

Barbara Sharp

Nicholas Högasten

Katrin Strandemar

Brian B Simolon

Andrew C Teich

Dwight T Dumpert

Jeffrey D Frank

Michael J Fox

Malin Ingerhed

Jeffrey S Scott

Naseem Y Aziz

Robert F Cannata

Jim Goodland

Joseph Kostrzewa

Vu L Nguyen

John D Schlesselmann

Thomas J Scanlon

Gerald W Blakeley, Iii

Shawn Jepson

Katrin Strademar

Gerald W Blakeley

Steve Barskey

Nicholas HÖGASTEN

An imager array may be provided as part of an imaging system. The imager array may include a plurality of infrared imaging modules. Each infrared imaging module may include a plurality of infrared sensors associated with an optical element. The infrared imaging modules may be oriented, for example, substantially in a plane facing the same direction and configured to detect images from the same scene. Such images may be processed in accordance with various techniques to provide images of infrared radiation. The infrared imaging modules may include filters or lens coatings to selectively detect desired ranges of infrared radiation. Such arrangements of infrared imaging modules in an imager array may be used to advantageous effect in a variety of different applications.

Imager with array of multiple infrared imaging modules

Various techniques are provided for implementing a segmented focal plane array (FPA) of infrared sensors. In one example, a system includes a segmented FPA. The segmented FPA includes a top die having an array of infrared sensors (e.g., bolometers). The top die may also include a portion of a read-out integrated circuit (ROIC). The segmented FPA also includes a bottom die having at least a portion of the ROIC. The top and the bottom dies are electrically coupled via inter-die connections. Advantageously, the segmented FPA may be fabricated with a higher yield and a smaller footprint compared with conventional FPA architectures. Moreover, the segmented FPA may be fabricated using different semiconductor processes for each die.

Segmented focal plane array architecture

Techniques are disclosed for systems and methods for facilitating pixel readout with partitioned analog-to-digital conversion. A device includes a detector, a capacitor coupled to the detector, a counter circuit coupled to the capacitor, a reset circuit coupled to the capacitor, and a processing circuit. The detector is configured to detect electromagnetic radiation associated with a scene and generate an associated detection signal. The capacitor is configured to, during an integration period, accumulate a voltage based on the detection signal. The counter circuit is configured to, during the integration period, adjust a counter value based on a comparison of the voltage and a reference voltage. The reset circuit is configured to, during the integration period, reset the capacitor based on the comparison. The processing circuit is configured to generate a digital detector output based on the counter value when the integration period has elapsed. Related methods are also provided.

Pixel readout with partitioned analog-to-digital conversion systems and methods

Various techniques are provided to monitor electrical equipment. In some implementations, a monitoring system for a cabinet may include an infrared camera and a non-thermal camera. The infrared camera may be configured to capture one or more thermal images of at least a portion of electrical equipment positioned in an interior cavity of the cabinet. The non-thermal camera may be configured to capture one or more non-thermal images such as visible light images of the portion of electrical equipment. In some implementations, combined images may be generated that include characteristics of the thermal images and the non-thermal images for viewing by a user. In some implementations, the cameras may receive electrical power through a physical coupling to an electrical connector within the cabinet and/or through electromagnetic energy harvesting techniques. Other implementations are also provided.

Electrical cabinet infrared monitor systems and methods

Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. For example, a device attachment may include a housing with a tub on a rear surface thereof shaped to at least partially receive a user device, an infrared sensor assembly disposed within the housing and configured to capture thermal infrared image data, and a processing module communicatively coupled to the infrared sensor assembly and configured to transmit the thermal infrared image data to the user device. Thermal infrared image data may be captured by the infrared sensor assembly and transmitted to the user device by the processing module in response to a request transmitted by an application program or other software/hardware routines running on the user device.

Device attachment with infrared imaging sensor

Techniques using small form factor infrared imaging modules are disclosed. An imaging system may include visible spectrum imaging modules, infrared imaging modules, illumination modules, and other modules to interface with a user and/or a monitoring system. Visible spectrum imaging modules and infrared imaging modules may be positioned in proximity to a scene that will be monitored while visible spectrum-only images of the scene are either not available or less desirable than infrared images of the scene. Imaging modules may be configured to capture images of the scene at different times. Image analytics and processing may be used to generate combined images with infrared imaging features and increased detail and contrast. Selectable aspects of non-uniformity correction processing, true color processing, and high contrast processing, may be performed on the captured images. Control signals based on the combined images may be presented to a user and/or a monitoring system.

Compact multi-spectrum imaging with fusion

A bolometer circuit may include an active bolometer configured to receive external infrared (IR) radiation and a resistive load, which are configured to be connected in series in a bolometer conduction path from a supply voltage node to a common voltage node. A node in the bolometer conduction path between the resistive load and the active bolometer is coupled to a first input of an op-amp. A variable voltage source is coupled to a second input of the op-amp to provide a reference voltage level. The op-amp maintains the reference voltage level at the first input to generate a current flow in response to a resistance change of the active bolometer due to the external IR radiation. The amplifier circuit may be configured as a feedback amplifier or an integrating amplifier. The bolometer circuit may be configured to enable a low-power mode of operation.

Low cost and high performance bolometer circuitry and methods

Various techniques are provided for implementing an infrared imaging system. In one example, a system includes a focal plane array (FPA). The FPA includes an array of infrared sensors adapted to image a scene. The FPA also includes a bias circuit adapted to provide a bias voltage to the infrared sensors. The bias voltage is selected from a range of approximately 0.2 volts to approximately 0.7 volts. The FPA also includes a read out integrated circuit (ROIC) adapted to provide signals from the infrared sensors corresponding to captured image frames. Other implementations are also provided.

Low power and small form factor infrared imaging

Various techniques are provided for binning (e.g., clustering or grouping) two or more infrared sensors of a focal plane array (FPA) to permit configuration of the FPA to various dimensions and/or pixel sizes. For example, according to one or more embodiments, switchable interconnects may be implemented within the FPA, wherein the switchable interconnects comprise a plurality of switches adapted to selectively connect or disconnect infrared sensors of the FPA to/from column lines, row lines, and between each other. The switchable interconnects may also comprise another set of switches adapted to selectively connect adjacent column lines together. By selectively opening and closing appropriate switches of the switchable interconnects, two or more neighboring infrared sensors may be binned together to form a binned detector. Advantageously, the binned detector, along with the array and associated circuitry, may provide increased sensitivity, reduced power consumption, and/or increased frame rate.

Infrared detector array with selectable pixel binning systems and methods

Techniques using small form factor infrared imaging modules are disclosed. An imaging system may include visible spectrum imaging modules, infrared imaging modules, and other modules to interface with a user and/or a monitoring system. Visible spectrum imaging modules and infrared imaging modules may be positioned in proximity to a scene that will be monitored while visible spectrum-only images of the scene are either not available or less desirable than infrared images of the scene. Imaging modules may be configured to capture images of the scene at different times. Image analytics and processing may be used to generate combined images with infrared imaging features and increased detail and contrast. Triple fusion processing, including selectable aspects of non-uniformity correction processing, true color processing, and high contrast processing, may be performed on the captured images. Control signals based on the combined images may be presented to a user and/or a monitoring system.

Time spaced infrared image enhancement

In one embodiment, an infrared (IR) sensor module includes an IR sensor assembly, including a substrate, a microbolometer array disposed on an upper surface of the substrate; and a cap disposed on the upper surface of the substrate and hermetically enclosing the microbolometer array. A base is disposed below the substrate, and a heat spreader having a generally planar portion is interposed between a lower surface of the substrate and an upper surface of the base. In some embodiments, the heat spreader can include a material having an anisotropic thermal conductivity, e.g., graphite.

Infrared focal plane array heat spreaders

Various techniques are provided to detect abnormal clock rates in devices such as imaging sensor devices (e.g., infrared and/or visible light imaging devices). In one example, a device may include a clock rate detection circuit that may be readily integrated as part of the device to provide effective detection of an abnormal clock rate. The device may include a ramp generator, a counter, and/or other components which may already be implemented as part of the device. The ramp generator may generate a ramp signal independent of a clock signal provided to the device, while the counter may increment or decrement a count value in response to the clock signal. The device may include a comparator adapted to select a current count value of the counter when the ramp signal reaches a reference signal. A processor of the device may be adapted to determine whether the clock signal is operating in an acceptable frequency range, based on the selected count value.

Growing community of inventors

Goleta, CA, United States of America

Mark Nussmeier