Other

Mark N Shepard

Patrick R Antaki

A method and system is provided for constructing a multilevel structure using a hybrid top chord bearing floor framing system. The method and system may include a top chord bearing floor truss positioned on a first frame structure. The top chord of the truss may include a load-bearing interface with a top surface and a bottom surface. The truss may be wholly supported by the load-bearing interface of the top chord. The method and system may further include a second frame structure on the top surface of the truss. The first frame structure may be secured to the second frame structure via a fastener that extends through both the second bottom load bearing member and load-bearing interface of the truss into the first top load bearing member of the first frame structure.

Hybrid top chord bearing framing system

This invention discloses a novel method of manufacturing optical communications infrastructures that are implemented on a flat semiconductor wafer. This invention has the following characteristics which enable the efficient manufacturing of a combination of elements onto such a wafer: the inherent surface flatness, crystal purity and uniformity over a relatively large dimension for semiconductor wafers; the low cost and wide availability of such wafers; and the ability to combine several types of elements onto the wafer, on a very dense scale, and in a highly repeatable and mechanically aligned manner.

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Dallas, TX, United States of America

Mark N Shepard