Cooligy, Inc.

Other

Mark Munch

Thomas W Kenny

Kenneth E Goodson

James Gill Shook

David Corbin

Peng Zhou

Girish Upadhya

Mark McMaster

Shulin Zeng

Douglas E Werner

Paul Tsao

Dave B Corbin

Saroj Kumar Sahu

Richard Grant Brewer

Daniel J Lenehan

James Lovette

Adrian I Cogan

Ian G Spearing

Ali Firouzi

Norman Chow

Richard A Herms

James Hom

Hugh Duffy

Bruce R Conway

Shukri J Souri

Madhav Datta

Zbigniew Cichocki

Tim Schrader

Frederic Landry

Nick Nickols

Mikako A Munch

Yoshimi Munch

Rick Brewer

Girish Upadhaya

James Horn

A closed loop cooling system and apparatus for controlling a fluid flow rate through the closed loop cooling system, the apparatus comprising a heat exchanger coupled to at least one heat generating device for removing waste heat from the heat generating device, at least one pump for circulating the fluid, a heat rejector for receiving the fluid, at least one fan for removing waste heat from the heat rejector, at least one temperature sensor coupled to the heat generating device to measure the temperature value of the at least one heat generating device, and a controller electrically coupled to the at least one pump, the at least one fan, and the at least one temperature sensor for receiving the temperature value to selectively control the fluid flow rate and the air flow rate, based on the temperature value.

Pump and fan control concepts in a cooling system

A system for cooling a heat source includes a fluid heat exchanger, a pump, a thermoelectric device and a heat rejector. The thermoelectric device includes a cooling portion and a heating portion. The heat rejector is configured to be in thermal contact with at least a portion of the heating portion of the thermoelectric device. The pump is coupled with the fluid heat exchanger and configured to pass a fluid therethrough. The thermoelectric device is configured along with the heat exchanger in the cooling system.

Cooling systems incorporating heat exchangers and thermoelectric layers

An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. A pump is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a programmable controller connect the an air-mover, pump and temperature sensing device.

Integrated liquid to air conduction module

A detachable material wrapped around a strap of a footwear guards against blister formation, provides comfort and a softer feel against a foot, and to add aesthetic value. In one embodiment, the detachable material is a strip made of self-fastening material. In another plurality of loops. The detachable material is reusable and adjustable.

Strap wrap

The multi-layer tape wrapped tubing for effectively impeding the diffusion of vapor is made in a continuous in-line process and has three distinct layers: an inner tubing layer, a middle diffusion barrier layer and an outer jacketing layer. The inner tubing layer comes into contact with liquid and vapor. Vapor that might ordinarily diffuse through the tubing is impeded by the diffusion barrier layer. The diffusion barrier layer is a laminate comprising a diffusion barrier film with a very low vapor diffusion rate sandwiched between layers of thermoplastic. The diffusion barrier layer is wrapped around the inner tubing one or more times. The outer jacket layer is a polymeric jacket which is extruded onto the diffusion barrier layer wrapped inner tubing.

Tape-wrapped multilayer tubing and methods for making the same

An structure and method of manufacturing a microstructure for use in a heat exchanger is disclosed. The heat exchanger comprises a manifold layer and an microstructured region. The manifold layer comprises a structure to deliver fluid to the microstructured region. The microstructured region is formed from multiple windowed layers formed from heat conductive layers through which a plurality of microscaled apertures have been formed by a wet etching process. The plurality of windowed layers are then coupled together to form a composite microstructure.

Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system

One or more heat exchangers are coupled to one or more heat sources using a single gimballed joining mechanism. The joining mechanism includes a gimbal plate and a gimbal joint. The gimbal joint enables independent application of a retention force to the heat exchanger as a single-point load. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of retention force directed through the gimbal joint to each heat exchanger. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.

Gimballed attachment for multiple heat exchangers

Liquid-based cooling solutions used to transfer heat produced by one or more heat generating devices from one or more electronics servers to the ambient. Each electronics server includes one or more heat generating devices. Integrated onto each electronics server is a liquid based cooling system. Each liquid based cooling system includes a server pump and one or more microchannel cold plates (MCP) coupled together via fluid lines. The liquid based cooling system for each electronics server includes a rejector plate configured with micro-channels. The MCPs, the server pump and the rejector plate form a first closed loop. The rejector plate is coupled to a chassis cold plate via a thermal interface material. In a multiple electronics server configuration, the rejector plates for each of the electronics servers are coupled to the chassis cold plate configured with fluid channels which are coupled via fluid lines to a liquid-to-air heat exchanging system to form a second closed loop.

Liquid cooling loops for server applications

A method of and apparatus for cooling heat-generating devices in a cooling system is disclosed. The apparatus includes various sensors, control schemes and thermal models, to control pump flow rates and fan flow rates to minimize power consumption, fan noise, and noise transients. The apparatus further includes at least one heat-generating device, at least one heat exchanger, and at least one heat rejector. The apparatus can also include many pumps and fans. The method includes controlling a fluid flow rate of at least one pump and an air flow rate of at least one fan, in a cooling system for cooling at least one device. The method comprises the steps of: providing at least one temperature sensor coupled to measure a temperature value of each device; receiving the temperature value from each temperature sensor; and providing a controller to selectively control the fluid flow rate and the air flow rate, based on each temperature value. The method can further include the step of filling at least a portion of a heat exchanger with a thermal capacitance medium for maintaining the temperature value of the device below a maximum allowable temperature during thermal transients, wherein the heat exchanger is thermally coupled to the device.

A liquid cooling system utilizing minimal size and volume enclosures, air pockets, compressible objects, and flexible objects is provided to protect against expansion of water-based solutions when frozen. In such a system, pipes, pumps, and heat exchangers are designed to prevent cracking of their enclosures and chambers. Also described are methods of preventing cracking in a liquid cooling system. In all these cases, the system must be designed to tolerate expansion when water is frozen.

Remedies to prevent cracking in a liquid system

A heat collection apparatus is mounted to the heat source using a gimbal plate, which includes a gimbal joint. The gimbal joint enables application of a retaining force to the heat collection apparatus as a single-point load. The retaining force is applied along a vector that is collinear to the face-centered normal vector of the thermal interface of the heat source. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of mating force directed through the gimbal joint to the heat collection device. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.

Semi-compliant joining mechanism for semiconductor cooling applications

Growing community of inventors

Los Altos Hills, CA, United States of America

Mark Munch