Western Digital (fremont), Inc.

Western Digital Technologies, Inc.

Mark Moravec

Lei Wang

Wentao Yan

Yuhsuke Matsumoto

David Patrick Druist

Glenn Paul Gee

Kenichi Murata

Adisak Tokaew

Theera Yaemglin

Alan H Brothers

Subrata I Gusti Made

Santi Pumkrachang

Kittikom Nontprasat

Chakkrit Supavasuthi

Suwanchai Kongdum

Phanphat Taechangam

Michael Ranes

Peter Paolo Dilla

Disclosed herein is a magnetic storage device that comprises a suspension arm co-movably fixed to a carriage arm. The suspension arm comprises a slider attachment side and at least one first electrical contact pad on the slider attachment side. The suspension arm also comprises a slider co-movably fixed to the suspension arm. The slider comprises a suspension attachment side, a non-head side facing the suspension arm and intersecting the suspension attachment side at a first slider edge of the slider, a head side facing away from the suspension arm, and at least one electrical contact component on the suspension attachment side up to the first slider edge. At least one solder weldment is directly coupled to the at least one first electrical contact pad and the at least one electrical contact component. Additionally, a read-write head is coupled to the head side of the slider.

Slider and suspension arm interconnection for magnetic storage device

Systems and methods for correcting read/write overlay errors in the manufacture of magnetic transducers for storage drives are provided. One such system includes a twisting tool configured to receive and secure a row bar having an elongated rectangular block shape and including a plurality of magnetic transducers spaced apart along a length of the row bar, and where the twisting tool is configured to twist the row bar at a plurality of areas along the length of the row bar.

Systems and methods for correcting read/write overlay errors in the manufacture of magnetic transducers for storage drives

Magnetic heads are fabricated by slicing and dicing wafers into row bars, which undergo frontside lapping and backside lapping. These lapping processes, as well as other processes, induce stresses on the row bars that are released prior to finalizing the magnetic head. Ultrasonic impact technology is used to release the stress in the row bars and to clean the row bars at the same time. Ultrasonic impact technology is used after the row bars have been wire bonded without having to de-bond the row bars.

Method to stress relieve a magnetic recording head transducer utilizing ultrasonic cavitation

A method for manufacturing a read head includes the step of depositing a conductive filler into a plurality of holes that extend through a wafer. Each of the holes extends from a wafer top surface to a wafer bottom surface. Each of the holes includes an inner surface that includes an insulative layer. The method further includes the steps of fabricating a read transducer on the wafer top surface, and depositing a plurality of electrically conductive leading connection pads on the wafer bottom surface. The plurality of electrically conductive leading connection pads are in electrical contact with the conductive filler.

Method for manufacturing a read head having conductive filler in insulated hole through substrate

A system for providing energy assisted magnetic recording (EAMR) heads using a substrate is described. The substrate has front and back sides and apertures therein. The apertures are through-holes between the front and back sides of the substrate. The system includes providing a transmission medium in the apertures and fabricating EAMR transducers on the front side of the substrate. The EAMR transducers correspond to the apertures and the EAMR heads. The system also includes electrically insulating the back side of the substrate. The back side of the substrate is also prepared for mounting of the lasers. The lasers then are coupled the back side of the substrate. The lasers correspond to the EAMR heads and are configured to provide light through the apertures to the EAMR transducers. The system also includes separating the substrate into the EAMR heads.

System for providing an energy assisted magnetic recording head having a leading face-mounted laser

Embodiments of the present invention relate to integral heating elements in solder pads for flip chip bonding. The integral heating elements are used to solder components together without exposing other locations and components in the assembly to potentially damaging temperatures. Embodiments of the invention may be used in manufacture of magnetic heads for EAMR hard disks to bond a laser sub-mount to an air-bearing slider without exposing magnetic head components to high temperatures.

Localized heating for flip chip bonding

Growing community of inventors

Lamlukka, Thailand

Mark Moravec