Infinera Corporation

Jds Uniphase Corporation

Santur Corporation

Mark Missey

Charles H Joyner

Fred A Kish, Jr

Radhakrishnan L Nagarajan

David F Welch

Richard P Schneider

Atul Mathur

Vincent G Dominic

Frank H Peters

Stephen G Grubb

Frank Peters

Alan C Nilsson

Robert B Taylor

Matthew L Mitchell

Jonas Webjorn

Ting-Kuang Chiang

Drew Daniel Perkins

Mehrdad Ziari

Marco Sosa

Peter Weindel Evans

Bardia Pezeshki

Anca L Sala

Andrew G Dentai

Damien Lambert

Masaki Kato

Robert J Lang

Barthelemy Fondeur

Pavel Viktorovich Studenkov

Donald J Pavinski

Matthew Fisher

Robert Grencavich

Donald J Pavinski, Jr

Sanjeev Murthy

Vinh D Nguyen

Craig D Liddle

Bart Fondeur

Joseph Summers

August Spannagel

An apparatus having a first waveguide, a second waveguide, a third waveguide, a fourth waveguide, and a fifth waveguide is described. A symmetric coupler has a proximal end and a distal end. The proximal end of the symmetric coupler is coupled to and in optical communication with the first waveguide and the second waveguide. The distal end of the symmetric coupler is coupled to and in optical communication with the fourth waveguide. An asymmetric coupler has a proximal end and a distal end. The asymmetric coupler is in a cascaded configuration with the symmetric coupler. The cascaded configuration has the proximal end of the asymmetric coupler coupled to and in optical communication with the fourth waveguide and the third waveguide. The distal end of the asymmetric coupler is coupled to and in optical communication with the fifth waveguide.

Broadband waveguide based optical coupler

Consistent with an aspect of the present disclosure, a package is provided that has a carrier and first and second substrates provided on the carrier. Conductive traces are provided on the first substrate (upper traces) and below it (lower traces) to provide two levels of electrical connectivity to a photonic integrated circuit (PIC) provided on the second substrate. As a result, an increased number of connections can be made to the PIC in a relatively small package, while maintaining adequate spacing and line widths for each trace. In addition, the lower traces are connected to bonding pads on the surface of the first substrate and are thus provided in the same plane as the upper traces. Testing of and access to both upper and lower traces is thus simplified.

Dual-level package

A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Transmitter photonic integrated circuit (TxPIC) chip

Photonic integrated circuits (PICs) may include transmit and receive PICs that include individually tunable optical elements. In one implementation, a device may include a number of optical elements that form a number of optical channels. Tuners may be used to modify a property associated with the at least one of the optical elements where the modified properties of the optical elements adjust a frequency grid of the optical channels.

Tunable photonic integrated circuits

Transmitter photonic integrated circuit (TxPIC) chips

Monolithic transmitter photonic integrated circuit (TXPIC) with a transversely disposed output

A monolithic optical transmitter photonic integrated circuit (TxPIC) comprises a plurality of integrated modulated sources which, when all operated at constant current, display a power output that varies as a function of array position similar to a quadratic-shaped curve and, further, forming an array of signal channels each having a different wavelength output. An optical combiner/decombiner is integrated in the circuit and has at least one free space region with a plurality of ordered bands along its edge where the zero order band is substantially at a longitudinal centerline of the free space region and where, on either side of this band, is a first order band followed by additional higher order bands. The ends of the output waveguides from the modulated sources are coupled approximate to the free space region edge along a region of the zero order band between one of the adjacent first order bands and a longitudinal centerline of the zero order band so that the inputs of the signal channels to the combiner of are titled or offset with respect to the longitudinal centerline of the combiner free space region so the combined outputs from the optical combiner will be aligned along the slope of the quadric-shaped curve of the combiner output passband envelope. The tilted combiner/decombiner may also be deployed in a receiver photonic integrated circuit (RxPIC) or other circuit employing such a device.

Tilted combiners/decombiners and photonic integrated circuits (PICs) employing the same

Monolithic transmitter photonic integrated circuit (TxPIC) with a traversely disposed output

Optical transport network having a plurality of monolithic photonic integrated circuit semiconductor chips

A method for reducing insertion loss in a transition region between a plurality of input or output waveguides to a free space coupler region in a photonic integrated circuit (PIC) includes the steps of forming a passivation layer over the waveguides and region and forming the passivation overlayer such that it monotonically increases in thickness through the transition region to the free space coupler region.

Method of reducing insertion loss in a transition region between a plurality of input or output waveguides to a free space coupler region

A photonic integrated circuit that includes a plurality of active and passive components on a substrate where one of the components is an optical combiner/decombiner having at least one free space coupler region and a plurality of longitudinal ridge waveguides each extending in the circuit from a first region of the waveguide and coupled at a second region of the waveguide at the free space coupler region. A first dielectric layer formed over the ridge waveguides and the free space coupler region. The first dielectric layer monotonically increases in cross-sectional thickness from the waveguide first region to the second region to reduce signal insertion losses in transitioning from the ridge waveguides to the free space coupler region. The first dielectric layer may be covered with a second passivation layer. The first dielectric layer may be SiO, SiNor SiONand the second passivation layer may be BCB, ZnS or ZnSe.

Optical combiner/decombiner with reduced insertion loss

Photonic integrated circuit (PIC) chips

Transmitter photonic integrated circuits (TXPICS) with directly modulated lasers and wavelength selective combiners

Monolithic transmitter photonic integrated circuit (TxPIC) semiconductor chip

Tilted combiners/decombiners and photonic integrated circuit (PIC) employing the same

Growing community of inventors

San Jose, CA, United States of America

Mark Missey