Intel Corporation

Mark Macdonald

Min Suet Lim

Kristoffer Fleming

Jeff Ku

Juha Paavola

Shantanu Dattatraya Kulkarni

Jianfang Olena Zhu

Jered H Wikander

Daniel J Ragland

Arnab Sen

Yifan Li

Douglas Heymann

Jin Yan

Akhilesh P Rallabandi

Tongyan Zhai

Ruander Cardenas

James Raupp

David Kennedy

Rodny Rodriguez

Gaurav Patankar

Felipe Gonzalez

Hui Xiong

Matthew Fife

Yoshifumi Nishi

Apparatus, systems, and methods for intelligent tuning of overclocking frequency are disclosed. An example apparatus includes trial control circuitry to execute an optimization model to select first values for overclocking parameters of a processor, the first values associated with a first trial, and perform benchmark testing of the processor when the processor is operating based on the first values; trial evaluation circuitry to calculate a first score for the first trial based on the benchmark testing; and model updating circuitry to perform a comparison of the first score to a second score, the second score associated with a second trial for second values for the overclocking parameters, the second values different than the first values; and select one of the first values or the second values to overclock the processor based on the comparison.

Apparatus, systems, and methods for intelligent tuning of overclocking frequency

Heterogeneous heat pipe solutions provide both low thermal resistance and a high Q. Some heterogeneous heat pipe solutions comprise multiple homogenous heat pipes operating in parallel, with each homogeneous heat pipe having its thermal performance tailored to handle a processor operating in a particular power mode. Other heterogeneous heat pipe solutions comprise one or more heterogeneous heat pipes, each heterogeneous heat pipe having more than wick, each wick having a different set of wick characteristics (wick material, wick thickness, etc.). Heterogeneous heat pipes can provide a thermal management solution for processors over their full operating power range.

Interleaved heterogeneous heat pipes with different Q

Systems, apparatus, articles of manufacture, and methods are disclosed for accessories for electronic devices and removable fan cartridges for electronic devices. An example electronic device accessory includes a backplate panel removably couplable to a first chassis of a first electronic device to replace a portion of a first cover of the first chassis and removably couplable to a second chassis of a second electronic device to replace a portion of a second cover of the second chassis. The example electronic device accessory also includes a mating device to releasably couple the backplate panel to the first chassis and independently releasably couple the backplate panel to the second chassis and a fan coupled to the backplate panel. The fan is to increase a Z height of the first electronic device when the backplate panel is coupled to the first electronic device and increase a Z height of the second electronic device when the backplate panel is coupled to the second electronic device.

Removable fan cartridges for electronic devices

Growing community of inventors

Beaverton, OR, United States of America

Mark Macdonald