Henkel Corporation

Henkel Loctite Corporation

Henkel IP Holding Gmbh

Loctite Corporation

Henkel Ag & Company, Kgaa

Loctite (r&d) Limited

Mark M Konarski

John Gregory Woods

Lawrence N Crane

J Paul Krug

Charles Willard Paul

Andrew D Messana

Eerik Maandi

Yuxia Liu

Peter D Palasz

Yuhshi Luh

Afranio Torres-Filho

Zbigniew Andrew Szczepaniak

Brendan J Kneafsey

Shabbir Attarwala

Hsien-Kun Chu

Joel D Schall

Richard D Rich

Ronald E Belek

Frederick F Newberth, Iii

Darren Nolan

Lester D Bennington

Steven J Hemsen

Susan Lamtroung Levandoski

Ling Li

Brian Deegan

Dzu Dinh Luong

Erin K Yaeger

Vic Kadziela

Donna M Mamangun

Rebecca Tishkoff

Natalie R Li

Gina M Mazzella

Kyra M Kozak

Nicholas Penrose

Jeremy J Bober

Z Andrew Szczepaniak

Edwin R Perez

Gina Mazzella

Frederick Newberth

H K Chu

Dzu Luong

Lester Bennington

Natalie Li

A curable composition, includes a diluent, an epoxy functionalized resin derived from a nutshell oil, an epoxy-rubber copolymer adduct, and a curing agent. There is disclosed a method for making the curable composition, a method of imbuing improved flexibility to a curable composition and a method for improving oily metal adhesion of a curable composition. The method of imbuing improved flexibility to a curable composition includes providing a curable composition, adding an epoxy functionalized resin derived from a nutshell oil and adding a liquid modified hydrocarbon resin derived from a nutshell oil.

Curable compositions

Curable compositions, such as by way of exposure to radiation in the electromagnetic spectrum, for use as a primer composition for injection molding applications, are provided.

Primer compositions for injection molding

The present invention relates to curable barrier encapsulants or sealants for electronic devices that have pressure sensitive adhesive properties. The encapsulants are especially suitable for organic electronic devices that require lower laminating temperature profiles. The encapsulant protects active organic/polymeric components within an organic electronic device from environmental elements, such as moisture and oxygen.

Curable encapsulants and use thereof

Photolytically induced redox curable compositions, which show a delayed onset of cure resulting in controllable 'open times' for the end user consumer, are provided. These compositions are activated by exposure to electromagnetic radiation, such as UV/VIS radiation with a wavelength in the range of 254-470 nm, but show a commercially meaningful 'open time' prior to cure. This property is particularly attractive when opaque substrates and/or substrates with low transmissivity are to be assembled.

Photolytically induced redox curable compositions

The present invention provides visible light curing systems, methods for reducing health risks to individuals exposed to radiation curing systems, methods for bonding substrates and visible light curing compositions.

Visible light curing systems, methods for reducing health risks to individuals exposed to systems designed to cure curable compositions by exposure to radiation, methods for bonding substrates and visible light curing compositions

The present invention provides a UV curable composition comprising an acrylate component, comprising an acrylate-functionalized hydrogenated polybutadiene, and at least one mono-functional acrylate, and a photoinitiator combination triggered upon exposure to radiation at 365 nm of the electromagnetic spectrum comprising a bisacyl phosphine oxide and benzophenone, where when dispensed at a thickness of about 1 mm and exposed to UV radiation generated at a wavelength of 365 nm the composition cures through the thickness of the dispensed composition at a speed between 40 mm/sec to 100 mm/sec.

UV curable compositions

In accordance with the present invention, there are provided toughening agents which are useful for improving the performance properties of epoxy-based adhesive formulations. For example, epoxidized polybutylacrylates have been found to be useful toughening agents of component level underfill adhesive compositions. Invention materials are generally liquid rubbers which provided improved fracture toughness while maintaining satisfactory capillary flow properties. Invention materials can be synthesized in neat (solventless) reactions from readily available low-cost raw materials and isolated in high yields. They have a branched telechelic structure with terminal epoxide functional groups. The polyacrylate is typically obtained as a mixture of epoxidized polymer, chain extended polyoligomer and unreacted monomer. Invention materials are compatible with common epoxy formulations and may be used without purification. At low levels of incorporation, they provide adhesives that meet the minimum fracture toughness (Gq&#x3e;2.0 lb/in) and capillary flow specifications (flow time&#x3c;180 seconds) for many commercial underfill applications. In accordance with a further embodiment of the present invention, there are provided adhesive compositions comprising invention compounds and methods for use thereof. In additional embodiments of the present invention, there are provided methods for the preparation of invention toughening agents, methods for adhesively attaching a device to a substrate, and assemblies comprising first article(s) adhered to second article(s).

Epoxy-extended polyacrylate toughening agent

This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages ('CSPs'), ball grid arrays ('BGAs'), land grid arrays (&#x201c;LGAs&#x201d;), and the like, each of which having a semiconductor chip, such as large scale integration (&#x201c;LSI&#x201d;), on a carrier substrate, as well as compounds useful in such compositions. The compositions include compounds having a thermally cleavable linkage, and include an episulfide group within the compound. The compositions of this invention are reworkable when subjected to appropriate conditions.

Reworkable compositions incorporating episulfide resins

A flip-chip type integrated circuit chip including a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical interconnection with a carrier substrate is provided. The chip die includes a fluxing agent disposed on a surface of the electrical contacts, and a curable thermosetting underfill composition distinct from the fluxing agent and disposed in a flowable form over the chip die. Upon mating of the chip die with the substrate and heating, the electrical contacts flow and the thermosetting underfill composition cures, thus adhering the chip die to the substrate, forming a circuit assembly.

Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith

In accordance with the present invention, there are provided toughening agents which are useful for improving the performance properties of epoxy-based adhesive formulations. For example, epoxidized polysulfides have been found to be useful toughening agents of component level underfill adhesive compositions. Invention materials are liquid rubbers which provide improved fracture toughness while maintaining satisfactory capillary flow properties. Invention materials can be synthesized in neat (solventless) reactions from readily available low-cost raw materials and isolated in high yields. They have linear and branched telechelic structures with terminal epoxide functional groups, and are prepared without substantially increasing the molecular weight of the starting polysulfide materials. Invention materials are compatible with common epoxy formulations and may be used without purification. At low levels of incorporation, they provide adhesives that meet the minimum fracture toughness (Gq&#x3e;2.0 lb/in) and capillary flow specifications (flow time&#x3c;180 seconds) for many commercial underfill applications. In accordance with a further embodiment of the present invention, there are provided adhesive compositions comprising invention compounds and methods for use thereof. In additional embodiments of the present invention, there are provided methods for the preparation of invention toughening agents, methods for adhesively attaching a device to a substrate, and assemblies comprising first article(s) adhered to second article(s).

Polysulfide-based toughening agents, compositions containing same and methods for the use thereof

A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140&#xb0; C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.

Fluxing underfill compositions

A thermosetting resin is useful as an underfilling sealant form mounting semiconductors onto a printed circuit board and comprises (a) an epoxy resin containing at least one multifunctional epoxy resin, (b) an adhesion promotor having at least two secondary amine groups wherein the weight ratio of epoxy resin:adhesion promotor being from about 2:1 to about 20:1, (c) a curative of a nitrogen-containing compound and a transition metal complex; and, optionally, a polysulfide toughening agent.

Composition of epoxy resin, secondary amine-functional adhesion promotor and curative of nitrogen-compound and transition metal complex

The present invention provides a thermosetting resin composition useful as a highly filled low CTE underfilling sealant composition which completely fills the underfill space in a semiconductor device, such as a flip chip assembly which includes a semiconductor chip mounted on a carrier substrate, enables the semi-conductor to be securely connected to a circuit board by heat curing and with good productivity, and demonstrates acceptable heat shock properties (or thermal cycle properties). The thermosetting resin composition which is used as an underfilling sealant between such a semiconductor device and a circuit board to which the semiconductor device is electrically connected, includes an epoxy resin component, a latent hardener component, and a polysulfide-based toughening component. The latent hardener component includes a modified amide component and a latent catalyst therefor. Optionally, the inventive composition includes a filler, desirably at least a portion of the filler should have a particle size in the range of 1 to 1,000 nanometers.

Thermosetting resin compositions useful as underfill sealants

Thermosetting resin compositions useful as underfill sealants for mounting semiconductor devices onto a circuit board are provided, which include epoxy resins, an adhesion promoter having at least two secondary amine groups, and a curative based on the combination of nitrogen-containing compounds and transition metal complexes.

Underfill sealant of epoxy resins, adhesion promotor and curative of N-containing compound and transition metal complex

Growing community of inventors

Old Saybrook, CT, United States of America

Mark M Konarski