Rohm & Haas Electronic Materials LLC

Dow Global Technolgoies LLC

Shipley Company LLC

Mark Lefebvre

Erik Reddington

Yi Qin

Donald E Cleary

Matthew A Thorseth

Gonzalo Urrutia Desmaison

Zuhra I Niazimbetova

Julia Woertink

James G Shelnut

Martin William Bayes

Leon Barstad

Denis Morrissey

Joanna Dziewiszek

David Merricks

Donald E Storjohann

Zukra I Niazimbetova

Jitendra Singh Goela

Michael A Pickering

Michael P Toben

Zukhra I Niazimbetova

Neil D Brown

Angelo B Chirafisi

Robert A Schetty, Iii

Jamie L Triba

Kristen Flajslik

Jeffrey M Calvert

Eugene N Step

Julia Kozhukh

Elie H Najjar

James L Martin

Stephane Menard

Mark Scalisi

James E Rychwalski

Luis A Gomez

Rebecca Lea Hazebrouck

Bryan Lieb

Leon R Barstad

Mark A Scalisi

Niazimbetova Zuhra

Robert A Iii Schetty

Indium electroplating compositions containing amine compounds in trace amounts to electroplate substantially defect-free uniform indium which has a smooth surface morphology. The indium electroplating compositions can be used to electroplate indium metal on metal layers of various substrates such as semiconductor wafers and as thermal interface materials.

Indium electroplating compositions containing amine compounds and methods of electroplating indium

Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds

Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyridyl alkylamines and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyridyl alkylamines and bisepoxides

Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole compounds, bisepoxides and halobenzyl compounds to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds

Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of &#x3b1;-amino acids and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides

Iridium electroplating compositions containing 1,10-phenanthroline compounds in trace amounts to electroplate substantially defect-free uniform and smooth surface morphology indium on metal layers. The indium electroplating compositions can be used to electroplate indium metal on metal layers of various substrates such as semiconductor wafers and as thermal interface materials.

Indium electroplating compositions containing 1,10-phenanthroline compounds and methods of electroplating indium

Copper electroplating baths having a surface tension of &#x2266;40 mN/m are suitable for filling vias with copper, where such copper deposits are substantially void-free and substantially free of surface defects.

Plating method

Electroplating methods provide substantially uniform deposits of copper on the edges and walls of through-holes of printed circuit boards. The electroplating methods provide copper deposits which have high throwing power.

Method of electroplating uniform copper layers

Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.

Metal plating compositions and methods

An optical article and method of making the same are provided. The optical article has optical multi-aperture operation. The optical article has one or more electrically conductive and selectively passivated patterns.

Article having electrically conductive and selectively passivated patterns

Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.

Metal plating compositions

Optical article

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Mark Lefebvre