Sensata Technologies, Inc.

Kavlico Corporation

Mark L Urban

Marcos A Nassar

William Dale Cornwell

Ernest W Cordan

William D Cornwell

A differential capacitive pressure sensor of an embodiment of the present invention has first and second diaphragms positioned on opposing sides of a single substrate. Each diaphragm of the pressure transducer is configured to be exposed to a transient fluid, with the first and second pressure transducers being arranged with their respective deflection surfaces directed outwardly from each other. The differential capacitive pressure sensor may be configured to output representations of differential and common mode pressure of the transient fluids, where a representation of a common mode is cancelled in generating the representation of the differential pressure. The transient fluids may be the same fluid at different locations within a flow path. The diaphragms may be constructed from a ceramic material to be able to withstand exposure to corrosive or caustic fluids.

Differential pressure sensor with dual output using a double-sided capacitive sensing element

A capacitive pressure transducer of an embodiment of the present invention capacitively couples two electrodes on a substrate with a diaphragm electrode to form a transducing circuit without the need for a physical connection between the electrodes. Embodiments of the present invention have a substrate with a coupling electrode and a sensing electrode and an attached diaphragm with a diaphragm electrode. A spacer positioned between the substrate and the diaphragm provides for a cavity that defines a gap between the sensing electrode and the diaphragm electrode. A dielectric spacer may be positioned over the coupling electrode to increase the capacitance between the coupling electrode and the diaphragm electrode. The capacitive pressure transducer has similar electrical characteristics as existing capacitive pressure transducers, is easier to manufacture, and has long-term reliability and durability improvements brought about by the elimination of mechanical interconnects and additional conductive materials.

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Ventura, CA, United States of America

Mark L Urban