Kingston Technology Corporation

Mark Kuanyu Cheng

Mark Burlington

Henry Hai Dang Nguyen

An electronic component module according to an embodiment of the present invention includes a printed circuit board including a low-profile plug and at least one memory component thereon, and a connector for connecting the printed circuit board to a motherboard, the connector being mateable with the plug on the printed circuit board and having a z-height of no more than about 1.5 mm. The low-profile plug includes one hundred seventy pins and the number of pins allocated for VSS is no more than twenty-two and the number of pins allocated for VDD is no more than sixteen. Further, the low-profile plug includes an insulative portion protruding from a surface of the printed circuit board and having a ''-like or inverted ''-like profile in its center. The connector includes two sub-connectors, and an insulative portion having a &#x201c;&#x201d;-like or inverted &#x201c;m&#x201d;-like profile in the center.

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Fountain Valley, CA, United States of America

Mark Kuanyu Cheng