International Business Machines Corporation

Globalfoundries Inc.

Mark Kenneth Hoffmeyer

Phillip V Mann

John Lee Colbert

William Louis Brodsky

Phillip Duane Isaacs

Arvind Kumar Sinha

Roger Duane Hamilton

Timothy P Younger

Prabjit Singh

Bruce John Chamberlin

Sarah K Czaplewski-Campbell

Theron Lee Lewis

Karl Stathakis

James D Bielick

Christopher Michael Marroquin

Jason R Eagle

James R Stack

David Allen Sluzewski

Eric J Campbell

John Richard Dangler

Brian Samuel Beaman

Eric Alan Eckberg

Matthew Stephen Kelly

Yuet-Ying Yu

Wai Mon Ma

Thomas Donald Kidd

Amanda Elisa Ennis Mikhail

Arch F Nuttall

Michael J Ellsworth, Jr

Frank Louis Pompeo

Mark James Jeanson

Steven Paul Ostrander

Benjamin A Fox

Sukhvinder Singh Kang

Stephen Michael Hugo

David Paul Barron

Steve Ostrander

Roger John Gravrok

Amanda Elisa Mikhail

David Lawrence Pease

Matthew Tant Richardson

Christopher William Mann

Todd Arthur Cannon

William James Csongradi, Jr

Ryan James Schlichting

Daren Simmons

Daniel Scott Johnson

Matthew Stephen Doyle

David Clifford Long

Gerald Keith Bartley

Charles Leon Arvin

Eric Vance Kline

Sri Muthuthamby Sri-Jayantha

Thomas Weiss

Jon Alfred Casey

Silvio Dragone

James A Busby

Kevin O'Connell

Michael J Fisher

Sandra J Shirk/Heath

William Santiago-Fernandez

David Peter Gaio

Thomas Edward Lombardi

Matthew Allen Butterbaugh

Ahmad D Katnani

David J Braun

James Aloysius Hagan

Charles L Reynolds

Roger Scott Krabbenhoft

Arthur J Higby

Paul W Schaefer

Paul Marian Harvey

Miles Frank Swain

Douglas A Baska

Timothy Charles Daun-Lindberg

Dale E Goodman

Chris Muzzy

Steven Dennis Keidl

Raymond J Thatcher

Brian L Carlson

Wayne J Rothschild

John Gregory Stephanie

Anil Yuksel

Kevin Drummond

Connie Jean Mathison

Charles J Guenther

Jeffrey A Taylor

Gregg A Knotts

Gregory S Killinger

David A Sluzewski

Vincent W Ting

Applying a solderable surface to conductive ink may include partially curing a conductive ink trace; applying, to the partially cured conductive ink trace, a conductive paste comprising conductive particles; and curing the partially cured conductive ink trace and the conductive paste.

Applying a solderable surface to conductive ink

Disclosed herein is a method for producing a land grid array (LGA) socket connector assembly and the resultant assembly. The method comprises providing a carrier having a first carrier thickness with an array of vias, each having a first diameter, providing pockets around top surfaces of the vias, each having a second diameter and creating a portion of the pockets having a second carrier thickness that is less than the first carrier thickness, providing socket contact springs, each comprising a hole support structure that supports the socket contact spring within the via, and a contact beam configured to contact a conductor of an integrated circuit to be placed within the socket connector assembly, wherein a portion of carrier having a first carrier thickness is configured to prevent the contact beam from inelastically deforming when bent under load. Alternately, a contact feature may be used to prevent the inelastic deformation.

Standoff and support structures for reliable land grid array and hybrid land grid array interconnects

Provided is a method for removing an electronic component from a printed wiring board. The method comprises applying an embrittlement agent to a lead of an electronic component that is soldered to the printed wiring board. The electronic component is removed from the printed wiring board by breaking the embrittled lead.

Liquid metal infiltration rework of electronic assembly

A method comprises inserting a press-fit element into a through hole on a substrate board. The method also comprises obtaining a target heat-application plan for the press-fit element. The method also comprises applying heat to the press-fit element. The method also comprises determining that the target heat-application plan has been completed. The method also comprises withdrawing heat from the press-fit element.

Reliability enhancement of press fit connectors

Pierced thermal interface constructions including a thermal interface material (TIM) structure comprising: a TIM sheet comprising a plurality of piercings, where each of the plurality of piercings comprises a cavity and displaced material, and where the displaced material from each of the plurality of piercings protrudes away from the TIM sheet.

Pierced thermal interface constructions

A thermal interface material (TIM) structure for directing heat in a three-dimensional space including a TIM sheet. The TIM sheet includes a lower portion along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first fold between the lower portion and the first side portion positioning the first side portion substantially perpendicular to the lower portion; and a second fold between the first side portion and the first upper portion positioning the first upper portion substantially perpendicular to the first side portion and substantially parallel to the lower portion.

Thermal interface material structures for directing heat in a three-dimensional space

A bottom side interposer provides a structurally balanced chip carrier module to reduce thermal warp and increase package robustness. The bottom side interposer is attached to the bottom of a chip carrier which carries semiconductor chips on the top side of the chip carrier. The top side of the chip carrier typically includes a top side interposer between the semiconductor chips and the chip carrier. The bottom side interposer has a coefficient of thermal expansion (CTE) that is similar to the chips and top side interposer, or tailored to have a CTE intermediate to the chips and the chip carrier. Pads on the bottom side interposer may be plated or fitted with solder balls to complete the module so the module can be connected to a printed circuit board.

Integrated circuit module with a structurally balanced package using a bottom side interposer

A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.

Fixture facilitating heat sink fabrication

An land grid array (LGA) or hybrid land grid array (HLGA) includes a socket housing and a plurality of electrical contacts. The socket housing is made of a first material that defines a first dielectric constant. The plurality of electrical contacts extends through the socket housing to electrically couple a printed circuit board on a first side of the socket housing to a processor on a second side of the socket housing. A coating of a second material that defines a second dielectric constant that is higher than the first dielectric constant covers surfaces of a subset of the plurality of electrical contacts.

Land grid array electrical contact coating

Provided is a method for removing an electronic socket from a printed wiring board. The method comprises placing an embrittlement sheet over an electronic socket on a printed wiring board. The electronic socket is mounted to the printed wiring board using a plurality of hidden solder joints. The method further comprises causing the embrittlement sheet to melt. The melted embrittlement sheet wets the plurality of hidden solder joints. The electronic socket is removed from the printed wiring board by breaking the embrittled solder joints.

Growing community of inventors

Rochester, MN, United States of America

Mark Kenneth Hoffmeyer