Other

Uab “rekin International”

State Research Institute Center for Physical Sciences and Technology

Vmti Fiziniu Ir Technologijos Mokslu Centras

Mark K Hyman

Daniel J Hyman

Peter D Bogdanoff

Leonas Naruskevicius

Leonas Narus̆kevic̆ius

Danas Budilovskis

Provided are chrome-free adhesion pretreatment processes for use on a variety of reinforced or unreinforced plastics and polymers, such as polyimides, polyetherimides and polyvinylchloride. The pretreatment process can be performed in a combination of two sequential operations, which includes treating with a first solution containing nitric acid and subsequently treating with a second solution that includes sulfuric acid and periodate ions. Alternatively, the pretreatment process can be performed by treatment with a single combined composition that includes nitric acid, sulfuric acid, and periodate ions. The pretreatment processes, either done in two separate solutions, sequentially, or in one combined solution, produce an adherent surface for further metallization of the article, with adhesional values of the metal layer higher than those achieved using conventional chromic acid pretreatment processes.

Chrome-free adhesion pre-treatment for plastics

The present invention relates to the adhesional pretreatment of plastics surface prior to their metallization by chemical or electrochemical methods and may be used in those industrial fields where decorative or functional metallic coatings on top of the plastic surfaces are needed. The purpose of the proposed invention is a high-quality adhesional pretreatment of plastic surface prior to metallization. The purpose is achieved by treating the plastic before to etch it 5-15 min at 50-70&#xb0; C. in the alcaline permanganic solution containing 1-3M NaOH and 0.1-0.5 M permanganate ions and acidic permanganic etching solution additionally contains 0.5-8.0 M of copper nitrate and the etching is performed at room temperature during 5-60 min.

Pretreatment of plastic surfaces for metallization to improve adhesion

This invention is a new type of relay that incorporates the functional combination of multimorph actuator elements with electrostatic state holding mechanisms in the development of a micromachined switching device. This combination of elements provides the benefits of high-force multimorph actuators with those of zero-power electrostatic capacitive latching in microfabricated relays with high reliability and low power consumption. The operation of the relay invention allows for several stable states for the device: a passive state using no power, an active state driving the multimorph actuator with some power, and a latched state electrostatically holding the switch state requiring essentially no power. Multimorph actuators covered by this invention include piezoelectric, thermal, and buckling multimorph actuation mechanisms. These devices use one or more sets of actuator armatures in cantilever or fixed-beam configurations, and use one or more sets of electrostatic latch electrodes for state holding.

Microfabricated double-throw relay with multimorph actuator and electrostatic latch mechanism

Microfabricated relay with multimorph actuator and electrostatic latch mechanism

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Long Beach, CA, United States of America

Mark K Hyman