Nortel Networks Corporation

Mark J Sonderegger

Balwantrai Mistry

Clifford D Read

Peter G Hill

Jacques J Gagnon

Vincent E Somoza

Marek Bugajski

Quintin A Boe

Michael Horton

Pak-Jong Chu

Michael Brown

Dean Boggia

Todd A Wood

Michael G Langlois

Michal Karin Jacob

Andrew Clarke

Floyd James Pushelberg

A carrier for alignment and attachment of an electronics module to a circuit board is described. The carrier includes a frame having sides defining a region to receive the electronics module. A gap between two of the sides allows for passage of leads that extend from the electronics module. The frame includes an alignment guide to align the electronics module to the carrier, an alignment guide to align the frame to the circuit board and a capture device to attach the electronics module to the frame. The carrier also includes a fiber guide or wire guide extending from one of the sides of the frame to secure an optical fiber or wire, respectively, extending from the electronics module. At least one of the sides of the frame has an opening to receive a fastener for attaching the carrier to the circuit board.

Laser module carrier for printed circuit boards

Described is an apparatus for dissipating heat and shielding electromagnetic radiation from at least one electronic device on a printed circuit board. The apparatus includes a printed circuit board with a surface, at least one integrated circuit on the surface, and an electrically conductive region surrounding the at least one integrated circuit. The apparatus also includes an electrically conductive cover portion. The electrically conductive cover portion has a top surface and a bottom edge, and defines a cavity. The top surface has at least one heat-dissipating structure that extends from it. The bottom edge is in electrically conductive contact with the electrically conductive region of the printed circuit board. The cavity encloses the at least one integrated circuit on the surface of the printed circuit board to shield electromagnetic radiation. The at least one integrated circuit is in thermally conductive communication with the electrically conductive cover portion. Heat generated by the at least one integrated circuit is transferred to the electrically conductive cover portion from which the heat is dissipated by the at least one heat-dissipating structure.

System for dissipating heat and shielding electromagnetic radiation produced by an electronic device

A device for conducting light through an electromagnetic compliant faceplate is described. The device includes a first light pipe, a second light pipe, and a connector. The first light pipe has a first end to receive light from a first light source and a second end with an expanded endface. The second light pipe has a first end to receive light from a second light source and a second end with an expanded endface. The connector is attached to the first and second light pipes and has an elongated portion, a first attachment portion and a second attachment portion. The first and second attachment portions extend from the elongated portion and are coupled to the first and second light pipes.

Device for conducting source light through an electromagnetic compliant faceplate

An electromagnetic compliant (EMC) shield for shielding electronic components on a circuit board from electromagnetic energy generated by electronics modules inside the EMC shield. The shield also contains electromagnetic energy generated by the electronic components on the circuit board from escaping to outside the EMC shield. The EMC shield includes a first side and a second side. The first side has a plurality of openings. Each of the openings is configured to receive a respective electronics module. The second side has a bottom edge with a groove to receive a conductive gasket. The first and second sides extend normal to the circuit board when the EMC shield is mounted to the circuit board.

Electromagnetic compliant shield having electrostatic discharge protection

Described is a release mechanism for disconnecting internal fiber from an optical module. The optical module comprises a board, a faceplate, an adapter connected to the faceplate, a fiber optic cable assembly having a fiber optic cable and a release tab that connects the fiber optic cable to the adapter, and an actuator. The actuator is connected to the board for rotational movement about a pivot point between a first position in which the actuator is adjacent to the release tab of the fiber optic cable assembly and a second position in which the actuator engages the release tab and urges the release tab into an unlatched position so that the fiber optic cable assembly can be disconnected from the adapter of the optical module.

Release mechanism for disconnecting internal fiber from an optical module

Described is a fiber optic cable clip for managing fiber optic cables connected to a faceplate of an optical module by bulkhead adapters or small form-factor pluggable fiber optic transceiver modules. The fiber optic cable clip includes a clip body having a front side, an upper end, and a lower end. The clip body has a curved shape that bends vertically and laterally from the upper end to the lower end. The front side of the clip body has a groove extending therethrough. The groove is shaped for receiving and bending the fiber optic cable vertically and laterally from the upper end to the lower end in accordance with the curved shape of the clip body. Coupler means on the clip body couple the fiber optic cable within the groove of the clip body.

Apparatus for multi-dimensional fiber management

Indoor communications cabinet

Outdoor communications panel

Outdoor communications cabinet

Indoor communications panel

Integrated communication access device

Outer periphery of a telephone base

Lightpipe

Telephone base

The present invention relates to an improved faceplate used in a connector assembly for electrical, electronic and optical applications. The faceplate has a staggered profile from the leading end to the trailing end, thereby providing a row of mating surfaces. Each successive mating surface being lower than the preceding one. At least one internal connector is disposed on each mating surface. The rear of each internal connector is connected to electrical, electronic or optical equipment. Respective external mating connectors mate with the front of each respective internal connector in a mating direction towards the faceplate. A cable is secured to each external mating connector and extends generally perpendicular with respect to the mating direction and towards the trailing end of the faceplate. The staggered profile accommodates or at least partly accommodates the cables secured to the external mating connectors.

Staggered Faceplate

Growing community of inventors

Kanata, Canada

Mark J Sonderegger