Intel Corporation

Mark J Luckeroth

Phani Kumar Kandula

David N Lombard

John Kelbert

Brad Bittel

Nikos Kaburlasos

Barrett M Faneuf

Mark J Gallina

Brian S Jarrett

Eric J M Moret

Eric J Moret

Mike G Macgregor

Jason B Chesser

Thu Huynh

Eric D Mcafee

Marc Beuchat

Rodrigo De Oliveira Vivi

Michelle Goeppinger

Disclosed herein are embodiments of systems and methods for stable and elevated idle-mode temperature for assembled semiconductor devices. In an embodiment, a processor includes a communication interface configured to receive, from a first hardware component, instructions assigned to the processor for execution. The processor also includes temperature-measurement circuitry configured to monitor an on-chip temperature of the processor. The processor also includes control logic configured to: determine whether the processor is active or idle; determine whether the on-chip temperature of the processor exceeds a first threshold; based on determining that the processor is idle and that the on-chip temperature of the processor exceeds the first threshold, disable one or more idle-mode power-saving features of the processor; and selectively adjust one or more operating parameters of the processor to keep the on-chip temperature of the processor between the first threshold and a second (higher) threshold.

Systems and methods for stable and elevated idle-mode temperature for assembled semiconductor devices

Methods, apparatus, systems, and articles of manufacture to reduce thermal fluctuations in semiconductor processors are disclosed. An apparatus includes a temperature analyzer to determine a current temperature of a processor. The apparatus further includes a controller to provide an idle workload to the processor to execute in response to the current temperature falling below a setback temperature.

Methods and apparatus to reduce thermal fluctuations in semiconductor processors

Systems and methods of fabricating circuit board assemblies may provide for a circuit board assembly that includes an expansion card having a first side and a second side, a first set of semiconductor packages coupled to the first side and a second set of semiconductor packages coupled to the second side. The circuit board assembly may also include a synergistic combination of cooling solutions for the expansion card such as a metallic duct, centrifugal fan or secondary plate, structural solutions for the expansion card such as a clamp structure or retention interlock, and volume reduction solutions for the expansion card such as one or more flipped power connectors.

Expansion card having synergistic cooling, structural and volume reduction solutions

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Portland, OR, United States of America

Mark J Luckeroth