Intel Corporation

Mark J Gallina

Aleksander Magi

Jianfang Olena Zhu

Steven Lofland

Catharina Biber

Xi Guo

Gabriele C Garbarino

David Pidwerbecki

Deepak Samuel Kirubakaran

Kevin Ceurter

Jianwei Dai

Martin Guy Dixon

Chia-Pin Chiu

Barnes Cooper

Stephen H Gunther

Min Suet Lim

Hong W Wong

Mark Angus MacDonald

Kristoffer Fleming

Jeff Ku

James G Hermerding, Ii

Pramod Malatkar

Chee Lim Nge

Michael D Rosenzweig

Chia-Hung Sophia Kuo

Daryl James Nelson

Barrett M Faneuf

Bo Qiu

Srikanth Potluri

Duncan Glendinning

Sapumal Wijeratne

Mohit Mamodia

Yifan Li

Kyle Yazzie

Brian S Jarrett

Jin Yan

Jerrod Peterson

Kevin J Daniel

Columbia Mishra

Adam J Norman

Akhilesh P Rallabandi

Virendra Vikramsinh Adsure

Carin Ruiz

Mike G Macgregor

Jason B Chesser

Naga Sivakumar Yagnamurthy

Kevin J Byrd

Thu Huynh

Mark J Luckeroth

Renji Thomas

Ivan Chen

Mark Hemmeyer

Ponniah Ilavarasan

Michael Stewart

Rajesh Kumar Neerukatti

Eric D Mcafee

Somvir Singh Dahiya

Joseph Bautista

Kai P Wang

Michael Gregory Drake

Michelle Goeppinger

Daniel Chiang

Hosam Haggag

Terry Pilsner

Arijit Chattopadhyay

Mahesh Kumar P

James Hermerding Ii

Methods, systems, and apparatus to reconfigure a computer are disclosed. An example electronic device includes at least one memory, instructions in the electronic device, and processor circuitry to execute instructions to analyze data corresponding to a first configuration of the electronic device to detect a change associated with the electronic device, the first configuration corresponding to a respective first user profile, determine a second configuration of the electronic device based on the detected change, and adjust a configuration of the electronic device from the first configuration to the second configuration.

Methods, systems, and apparatus to reconfigure a computer

An apparatus and method for temperature-constrained frequency control and scheduling. For example, one embodiment of a processor comprises: a plurality of cores; power management circuitry to control a frequency of each core of the plurality of cores based, at least in part, on a temperature associated with one or more cores of the plurality of cores, the power management circuitry comprising: a temperature limit-driven frequency controller to determine a first frequency limit value based on a temperature of a corresponding core reaching a first threshold; frequency prediction hardware logic to predict a temperature-constrained frequency of the corresponding core based on the first frequency limit value and an initial frequency limit value; and performance determination hardware logic to determine a new performance value for the corresponding core based on the temperature-constrained frequency, the new performance value to be provided to a task scheduler.

Apparatus and method for temperature-constrained frequency control and scheduling

Particular embodiments described herein provide for a flexible vapor chamber with shape memory material for an electronic device. In an example, the electronic device can include a flexible vapor chamber and shape memory material coupled to the shape memory material. When the shape memory material is activated, the shape memory material moves a portion of the flexible vapor chamber to a position that helps with heat dissipation of heat collected by the flexible vapor chamber.

Flexible vapor chamber with shape memory material

Methods, apparatus, and systems to dynamically schedule a workload to among compute blocks based on temperature are disclosed. An apparatus to schedule a workload to at least one of a plurality of compute blocks based on temperature includes a prediction engine to determine (i) a first predicted temperature of a first compute block of the plurality of compute blocks and (ii) a second predicted temperature of a second compute block of the plurality of compute blocks. The apparatus also includes a selector to select between the first compute block and the second compute block for assignment of the workload. The selection is based on which of the first and second predicted temperatures is lower. The apparatus further includes a workload scheduler to assign the workload to the selected one of the first or second compute blocks.

Methods, apparatus, and systems to dynamically schedule workloads among compute resources based on temperature

Enhanced thermal energy transfer systems for semiconductor packages are provided. A thermally conductive member is disposed in the interstitial space between an upper surface of a semiconductor package and a lower surface of a thermal member. The thermally conductive member is disposed above a first portion of the upper surface of the semiconductor package having a relatively higher thermal energy output when the semiconductor package is operating. A thermal interface material is disposed in the interstitial space and a force applied to the thermal member. The thermally conductive member forms a relatively higher pressure region above the first portion of the semiconductor package and a relatively lower pressure region in other portions of the semiconductor package remote from the thermally conductive member. The increased pressure region proximate the thermally conductive member beneficially enhances the flow of thermal energy from the first portion of the semiconductor package to the thermal member.

Enhanced systems and methods for improved heat transfer from semiconductor packages

The present techniques are related a dock with a cooling solution. The performance dock includes a thermoelectric device, an alignment mechanism, and an air mover. The alignment mechanism is to align the computing device when docking the computing device, and the thermoelectric device is to cool the computing device when docked, and the air mover is to enable an airflow through the dock to cool the thermoelectric device when the computing device is docked.

Cooling solution for a dock

Disclosed herein are integrated circuit (IC) packages with an electronic component having a patterned protective material on a face, as well as related devices and methods. In some embodiments, a computing device may include: an integrated circuit (IC) package with an electronic component having a protective material on the back face of the electronic component, where the protective material is patterned to include an area on the back face of the electronic component that is not covered by the protective material; a circuit board, where the IC package is electrically coupled to the circuit board; and a heat spreader, where the heat spreader is secured to the circuit board and in thermal contact with the area on the back face of the electronic component that is not covered by the protective material.

Integrated circuit packages with patterned protective material

Cooling solution for a performance dock

Systems and methods may provide for a device including a housing, one or more electronic components positioned within the housing, and a first cured resin composition positioned within the housing, the first cured resin composition including a thermal energy storage material and a first filler material. The device may also include a second cured resin composition positioned within the housing, the second cured resin composition including the thermal energy storage material and a second filler material. The first filler material and the second filler material may be different, wherein the first cured resin composition and the second cured resin composition may encompass at least one of the one or more electronic components. In other examples, the electronic components include a power supply and the device complies with an ATEX equipment directive for explosive atmospheres. Moreover, component underfill and/or assembly overmold processes may be used to fabricate the device.

Using materials to increase structural rigidity, decrease size, improve safety, enhance thermal performance and speed charging in small form factor devices

Systems and methods of fabricating circuit board assemblies may provide for a circuit board assembly that includes an expansion card having a first side and a second side, a first set of semiconductor packages coupled to the first side and a second set of semiconductor packages coupled to the second side. The circuit board assembly may also include a synergistic combination of cooling solutions for the expansion card such as a metallic duct, centrifugal fan or secondary plate, structural solutions for the expansion card such as a clamp structure or retention interlock, and volume reduction solutions for the expansion card such as one or more flipped power connectors.

Expansion card having synergistic cooling, structural and volume reduction solutions

Wireless dock

Mobile platforms and methods may provide for an integrated circuit such as a system on chip (SoC), a first heat spreader thermally coupled to the integrated circuit and a phase change material configuration thermally coupled to the first heat spreader. The integrated circuit may include logic to operate the integrated circuit in a performance burst mode according to a duty cycle, wherein the performance burst mode causes a phase change material to enter a liquid state within a graphite matrix of the phase change material configuration.

Thermal energy storage, dissipation and EMI suppression for integrated circuits using porous graphite sheets and phase change material

In some embodiments, a heatsink includes a thermally conductive core and at least ten thermally conductive fins extending quasi-radially from the thermally conductive core, wherein most of the fins are of uniform length, and wherein at least a portion of the thermally conductive core is shaped such that the fins having uniform length form a substantially rectangular cross sectional form factor. Other embodiments are disclosed and claimed.

Quasi-radial heatsink with rectangular form factor and uniform fin length

Growing community of inventors

Hillsboro, OR, United States of America

Mark J Gallina