Apple Inc.

Mark J Beesley

Daniel D Sunshine

Christopher Schultz

Michael B Nussbaum

Lan H Hoang

David M Kindlon

Chang Liu

Andrew L Rosenberg

Andrew Sterian

Breton M Saunders

Peter W Mash

David A Bolt

Steven J Keating

Anne M Mason

Shawn Xavier Arnold

Meng Chi Lee

Chad O Simpson

William Hannon

Daniel A Podhajny

Hao Shi

Shyam Harindralal Ratnayake

Albert A Onderick, Ii

Craig A Gammel

Nima Shahidi

Quan Qi

Kenneth Leland Kiplinger

Structures that implement three-dimensional (3D) conductive material (e.g., copper) in printed circuit boards (PCBs) are disclosed. 3D (three-dimensional) conductive material may include trenches and/or buried vias that are filled with conductive material in the PCBs. Trenches may be formed in build-up layers of a PCB by overlapping multiple laser drilled vias. The trenches may be filled with conductive material using electroplating process(es). Buried vias may be formed through the core layers of the PCB by mechanical drilling. The buried via may be filled with solid conductive material using a combination of electroless plating and electrolytic plating of conductive material. Various PCB structures are disclosed that implement combinations of these trenches and/or these buried vias filled with conductive material.

Three-dimensional (3D) copper in printed circuit boards

Printed circuit boards (PCB) used to mechanically and electrically connect electrical components within an electronic device. Thin printed circuit boards (PCB) may be desirable to manufacturers and users of electronic devices. Accordingly, a process for manufacturing a printed circuit board may involve manufacturing a thin bilayer dielectric. The process may involve applying a first non-conductive layer to a metal substrate, and curing the first non-conductive layer to a C-stage resin layer that is fully cross-linked layer in a clean environment. In turn, a B-stage layer that is partially cured may be applied to the C-stage resin layer. Using a hot press, one or more metal traces may be pressed onto the B-stage layer. The B-stage resin layer may be fully cross-linked and integrated with the C-stage resin layer after lamination of the one or more metal traces and the B-stage resin layer.

Systems and methods for manufacturing thin substrate

An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.

Electrical components attached to fabric

Described herein are printed circuit boards (PCBs), PCB assemblies, and methods of manufacture thereof, which allow free placement of electrical components. The PCBs may have electrical pads that may couple to components through via-based connections and without the use of solder. The electrical components may be physically attached to the PCBs through tight fitting, lamination, and/or the use of adhesives. The distance between adjacent vias may be reduced, as accidental short-circuit risks due to solder bridging and similar effects are mitigated when the soldering process is bypassed. The PCB design and component placement may be flexible as to allow the use of electrical components with custom shape and/or customized terminal placement.

Connection pad for embedded components in PCB packaging

Printed circuit boards having an increased density of vertical interconnect paths, as well as methods for their manufacture. One example may provide a printed circuit board having an increased density of vertical interconnect paths by forming a plurality of segmented vias. The segmented vias may extend through interior layers of the printed circuit board. The segmented vias may be formed of portions of vias in the interior layers of the printed circuit board. An area between three or more segmented vias may be filled with resin or other material or materials.

Segmented via for vertical PCB interconnect

An electronic device may have haptic output devices based on shape memory alloy wire. The electronic device may have control circuitry that supplies current to the shape memory alloy wire to heat and thereby contract the shape memory wire to create vibrations for a user's finger. The vibrations may serve as haptic feedback in a device such as a keyboard, a strap with embedded buttons, or other electronic devices. The shape memory alloy wire may run between upper and lower fabric layers in a spacer fabric, may form loops that attached to a fabric layer, or may be tensioned across an opening in a printed circuit or other rigid support structure.

Fabric devices with shape memory alloy wires that provide haptic feedback

Growing community of inventors

Carmel Valley, CA, United States of America

Mark J Beesley