Micron Technology Incorporated

Motorola Corporation

Infineon Technologies Ag

Digital Optics Corporation

Digitaloptics Corporation East

Infineon Technologies Sc300 Gmbh

Mark Hiatt

Mark E Tuttle

Brent Keeth

Kyle K Kirby

Terry R Lee

John Frederic Schreck

Rahul Advani

Warren M Farnworth

Salman Akram

Alan G Wood

David R Hembree

James M Wark

Michael R Feldman

Charles Martin Watkins

James E Morris

Gregory J Kintz

Steven David Oliver

David Ovrutsky

Sidney B Rigg

Dave Pratt

Steve Oliver

Jeremy Huddleston

W Hudson Welch

Paul C Elliott

David Keller

Lu Velicky

Karl Emerson Mautz

Larry E Frisa

Clinton Haris

Ralf Schuster

Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.

Signal delivery in stacked device

An optics block includes a substrate having first and second opposing surfaces, the substrate being a first material, a plurality of through holes extending in the substrate between the first and second opposing surface, a second material, different than the first material, filling a portion of the through holes and extending on a portion of the first surface of the substrate outside the through holes, and a first lens structure in the second material and corresponding to each of the through holes.

Recessed optical surfaces

The invention includes methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, methods of processing a semiconductor substrate, and semiconductor devices. In one implementation, a method of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit includes providing a semiconductor substrate comprising at least one integrated circuit die. The semiconductor substrate comprises a circuit side, a backside, and a plurality of conductive vias extending from the circuit side to the backside. The plurality of conductive vias on the semiconductor substrate backside is examined to determine location of portions of at least two of the plurality of conductive vias on the semiconductor substrate backside. From the determined location, x-y spatial orientation of the semiconductor substrate is determined. Other aspects and implementations are contemplated.

Semiconductor substrates comprising through substrate interconnects that are visible on the substrate backside

Methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, methods of processing a semiconductor substrate, and semiconductor devices

A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.

Through-wafer interconnects for photoimager and memory wafers

A process tool, preferably a spin coater, includes a set of at least three arms and an adjustable rinse nozzle. The arms lift a substrate, e.g. a semiconductor wafer, from a chuck inside the process chamber after having performed the corresponding manufacturing step, e.g. coating. The contact area between the arms and the substrate is as small as possible. The rinse nozzle dispenses a solvent liquid onto the backside of the substrate, thereby removing contaminating particles located at the area of contact between the vacuum channels of the chuck and the substrate. The set of arms rotates for a homogeneous cleaning. A gas flowing out of vacuum ports of the chuck prevents the vacuum ports from being obstructed with particles. While the substrate is being lifted, the chuck can also be cleaned by dispensing the solvent liquid onto the chuck.

Configuration and a method for reducing contamination with particles on a substrate in a process tool

An apparatus related to a lot signalling device used to find misplaced lots. A remote control signalling device comprises a receiver section ( ) for receiving an RF-command including a unique address of at least one of said plurality of remote control signalling devices ( ) from a central control unit ( ), an address memory ( ) for storing the address of said remote control signalling device, an output section ( ) for signalling an alarm upon receiving the RF-command, if said address included in the RF-command matches the stored address in said address memory ( ). A method for processing items at different process stages comprises the steps of: transmitting RF-commands including a unique address of at least one of said plurality of remote control signalling devices by a central control unit ( ), signalling an alarm by said remote control signalling device ( ) upon reception of an RF-command from said central control unit ( ).

Lot signalling device

Growing community of inventors

Eagle, ID, United States of America

Mark Hiatt