Texas Instruments Corporation

Halliburton Energy Services, Inc.

Mark Henry Strumpell

Richard Lee Knipe

Thomas Allan Kocian

Elling James Newell

James Carl Baker

David L Gillespie

David Mehrl

Michael A Mignardi

Michael Richard Douglass

Russell Stephen Haake

Kun Cindy Pan

Judith C Frederic

Rand Derek Carr

A burner nozzle assembly includes a plurality of burner nozzles. Each burner nozzle includes an outer housing and a nozzle receivable within the outer housing. An air inlet conveys air into a first burner nozzle of the plurality of burner nozzles and a well product inlet conveys a well product into the first burner nozzle. An air transfer conduit interposes and fluidly couples the outer housing of adjacent burner nozzles and transfers the air from the first burner nozzle to subsequent burner nozzles of the plurality of burner nozzles, and a well product transfer conduit interposes and fluidly couples the outer housing of adjacent burner nozzles and transfers the well product from the first burner nozzle to subsequent burner nozzles.

Burner nozzles for well test burner systems

A burner nozzle includes an outer housing, and a nozzle and a piston receivable within the outer housing. The piston is movable between an open position, where air and a well product are able to enter an atomizing chamber to generate an air/well product mixture, and a closed position, where the piston moves to stop a flow of the well product and a metered amount of air flows through one or more leak paths defined between a leading edge of each axial flow port and an adjacent closure surface provided by the nozzle body and into the atomizing chamber.

Burner nozzels for well test burner systems

A well test burner system includes a plurality of burner nozzles, each including an air valve and a well product valve movable between an open position, where air and a well product are allowed to circulate through the burner nozzle to discharge an air/well product mixture, and a closed position, where the air and the well product are prevented from circulating through the burner nozzle. One or more actuation devices are operatively coupled to the air valve and the well product valve to move the air valve and the well product valve between the open and closed positions.

Well test burner system and methods of use

The invention is directed to a novel and useful fluid-tight, metal-to-metal, annular seal which can be repeatedly cycled in a high temperature, high pressure environment. More specifically, the invention provides a metal-to-metal, annular, seal on a radially expandable sliding sleeve which moves longitudinally from a reduced ID section of a bore to an enlarged section of the bore. The seal is disengaged at the enlarged bore section resulting in rapid fluid flow and pressure equalization which would destroy many traditional elastomer seals.

High-temperature, high-pressure, fluid-tight seal using a series of annular rings

A microelectromechanical device has a movable first electrode and stationary second and third electrodes oriented parallel with the substrate. The first electrode is separated from the substrate and includes a first hinge oriented parallel to the substrate, with spaced apart extensions extending from opposing sides of the first electrode. The second and third electrodes are fixedly formed on the substrate adjacent to the opposing sides of the first electrode and have spaced apart extensions interspersed with the spaced apart extensions of the first electrode. The first electrode can move substantially parallel to the surface of the substrate such that the extensions of one side of the first electrode substantially overlap the extensions of the second electrode in a first state and the extensions of the other side of the first electrode substantially overlaps the extensions of the third electrode in a second state. A second hinge has one or more first posts fixedly coupled to the substrate and one or more second posts coupled to the first electrode, such that movement of the first electrode causes a twisting of the first and second hinges.

Non-contacting electrostatically driven MEMS device

A method and system in which a semiconductor wafer having a plurality of dies is inspected through a visual inspection and/or an electrical test. If certain of the dies on the wafer pass the inspection, then windows are mounted or affixed above those certain dies while they are still a part of the wafer.

MEMS device wafer-level package

A method and system for measuring the temporal response of a micromirror array to a variety of driving signals. A micromirror array is illuminated with a coherent light source so that a diffraction pattern is reflected from the micromirror array. One or more photodetectors are aligned with spots of light in the diffraction pattern that correspond to orders of the diffraction pattern. Diffraction pattern theory predicts that the intensity of these spots of light will vary as the tilt angle of the micromirrors is changed. Thus, by measuring the relative intensity of the spots of light as the micromirror array is provided with a variety of driving signals, many performance characteristics of the micromirror array can be measured. Some of these characteristics include the impulse response, the forced resonant frequency (i.e. the natural frequency), the damped resonant frequency, the quality factor of the micromirror response, the damping factor of the micromirror response, and the frequency transfer function. According to another aspect of the invention, the electromechanical compliance of the micromirrors in the micromirror array can also be measured. It is further contemplated that all of these measurements can be localized to specific regions on the surface of the micromirror array so that the variance of different characteristics across its surface can be analyzed. Another aspect of the disclosed invention is the measurement of the tilt angle of the micromirror array at a non-biased state.

Method and apparatus for measuring temporal response characteristics of digital mirror devices

A method for enhancing the optical performance of a reflective spatial light modulator by micro-planarizing surfaces within the SLM, such as the reflective surface of each pixel, by gas-cluster-ion-beam bombardment.

Surface micro-planarization for enhanced optical efficiency and pixel performance in SLM devices

A method and system of reducing the permanent accumulated deformation of a deflectable member of a micromechanical device through thermal stabilization. The accumulated deformation is due to the repeated bending or twisting of a flexible component of the micromechanical deice typically the repetitive deformation of a flexible hinge connecting a rigid member to substrate. After the device is fabricated, passivated (,), and packaged (,), the packaged device is baked (,) at a temperature of at least 120&deg; C. A 150&deg; C. bake for 12 to 16 hours is preferred. Lower temperatures required longer baking periods.

Reduced deformation of micromechanical devices through thermal stabilization

A micromechanical device (50) with spring tips (60) and its method of manufacture. A micromechanical device (50) is formed such that there is a deflectable element (36) suspended by at least one hinge (24a) over an air gap, at the bottom of which are landing stops (34a). The element (36) deflects on said hinge and comes into contact with the landing stops (34a) via at least one small metal protrusion (60), or spring tip. The spring tip flexes upon contact allowing more even distribution of forces and less wear and adhesion. The spring tips are formed in standard semiconductor processing steps with the addition of patterning the metal layer (64) from which the hinges are formed to create separated metal elements. When the deflectable element is formed, the metal forming that element bonds to the separated metal elements at the tips, thereby forming the spring tips.

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Allen, TX, United States of America

Mark Henry Strumpell