Rudolph Technologies, Inc.

August Technology Corp.

Rudolph Technology, Inc.

Mark Harless

Cory Watkins

Jeffrey L O'Dell

Thomas Verburgt

Pat Simpkins

David Vaughnn

Kevin Barr

Brian Delsey

Francy Abraham

Shaileshkumar Goyal

Gerald Brown

Willard Charles Raymond

Steve Herrmann

Jeremy Jenum

Norman L Oberski

An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc., and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.

Automated wafer defect inspection system and a process of performing such inspection

A wafer holding mechanism for holding a wafer of the type used in the manufacture of semiconductor devices is herein described. The mechanism has a first plate having a number of offsets that define at least one lip that extends radially inward of the offsets. A second plate is positioned adjacent the first plate and generally between the first plate and the lip such that one or more fingers coupled to the second plate oppose the lip that depends from the first plate. When the second plate is moved to a closed position, the at least one lip and the one or more fingers cooperatively grasp an edge of a wafer therebetween. The wafer holding mechanism is coupled to a drive that rotates the wafer before an imaging mechanism for capturing images of the wafer as it rotates.

Wafer holding mechanism

A semiconductor inspection tool comprises an edge top camera for obtaining images of a top edge of a wafer, an edge normal camera for obtaining images of a normal edge of the wafer, and a controller for receiving the images of the top edge of the wafer and the images of the normal edge of the wafer and for analyzing the images of the top edge of the wafer and the images of the normal edge of the wafer for wafer edge defects.

Edge inspection

An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc. and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.

A defect inspection system for the semiconductor and microelectronics industry. More particularly, the present invention relates to an automated defect inspection system for wafers or other semiconductor or electronic substrates of any kind or type that are transparent, translucent, opaque or otherwise capable of allowing at least some light to pass through.

Automated wafer defect inspection system using backside illumination

A method and apparatus for dynamically focusing an imaging mechanism on a moving target surface having a variable geometry is herein disclosed. Apparatus for focusing an imaging mechanism may include an objective, a prism, or another optical device that forms part of an optical train of an imaging mechanism, a sensor for measuring a distance to the target surface, and a mechanism for modifying the depth of focus of the objective, prism or other optical device. Data from the sensor may be used to create a predictive model of the target surface. Data from the sensor is also used to fit or correlate the generated model to an exemplary target. Data from the correlated model is used to drive the mechanism for modifying the depth of focus of the objective, prism, or other optical device to maintain the surface of the exemplary target in focus.

Dynamic focusing method and apparatus

An inspection system, and process for use thereof, for inspecting semiconductors or like substrates. The inspection system includes an inspection device and an auxiliary sensor apart from the inspection device. The auxiliary sensor is used to collect height data and generate a map of a semiconductor or like substrate to aids in focusing the inspection device.

Inspection tool with a 3D point sensor to develop a focus map

A frame grabber with switched fabric interface where in varying embodiments the fabric interface may be one of InfiniBand, Star Fabric, or PCI Express or the like.

Data transfer device with data frame grabber with switched fabric interface wherein data is distributed across network over virtual lane

An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc. and is specifically intended and designed for second optical wafer inspection, for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.

Growing community of inventors

Plymouth, MN, United States of America

Mark Harless