Advanced Semiconductor Engineering, Inc.

Mark Gerber

Hung-Yi Lin

Meng-Wei Hsieh

Hsu-Chiang Shih

Hsiu-Chi Liu

Yu Sheng Chang

A semiconductor device package includes an electronic component, an electrical contact and a reinforcement layer. The electronic component has a first conductive layer on a first surface of the electronic component. The electronic component has a through-silicon-via (TSV) penetrating the electronic component and electrically connected to the first conductive layer. The electrical contact is disposed on the first surface of the electronic component and electrically connected to the first conductive layer. The reinforcement layer is disposed on the first surface of the electronic component.

Semiconductor device package and method of manufacturing the same

A semiconductor package structure and a method of manufacturing the semiconductor package structure are disclosed. The semiconductor package structure includes a first semiconductor device having an active surface, a redistribution structure in electrical connection with the first semiconductor device, and a second semiconductor device bonded to the active surface of the first semiconductor device, and disposed between the first semiconductor device and the redistribution structure.

Growing community of inventors

Kaohsiung, Taiwan

Mark Gerber