Rockwell Automation Technologies Incorporated

Mark G Phillips

Steven C Kaishian

Lawrence D Radosevich

Bruce C Beihoff

Dennis L Kehl

Daniel G Kannenberg

Lee A Gettelfinger

Abdolmehdi Kaveh Ahangar

Lixiang Wei

Yogesh Popatlal Patel

Christian S Sartler

Christian Sartler

Methods and apparatus are presented for detecting degrading filter capacitors in motor drives or other power converters, in which an expected DC equivalent voltage and a measured DC equivalent voltage are computed according to sampled filter circuit currents and voltages, and compared to selectively identify filter capacitor degradation conditions in a power converter filter circuit.

Filter capacitor degradation identification using measured and expected voltage

A connector system is provided for use in power applications, such as for conveying three phase power in electrical enclosures. The system comprises plug assemblies in which a power conductor is mounted in a floating arrangement with elastically deformable conductive structures extending from either side thereof. A mating receptacle may be mounted on a bus conductor. Three such arrangements may be provided for conveying three phase power. The structures allow for plug-in mating of the system components while accommodating considerable translational and angular misalignment between the connector parts.

Power circuit electrical connection system

Power circuit electrical connection system and method

EMI shielding is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Power converter connection configuration

A terminal structure for power electronics circuits reduces the need for a DC bus and thereby the incidence of parasitic inductance. The structure is secured to a support that may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as by direct contact between the terminal assembly and AC and DC circuit components. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Power converter having improved terminal structure

EMI shielding in an electric vehicle drive is provided for power electronics circuits and the like via a direct-mount reference plane support and shielding structure. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support forms a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Vehicle drive module having improved EMI shielding

A terminal structure provides interfacing with power electronics circuitry and external circuitry. The thermal support may receive one or more power electronic circuits. The support may aid in removing heat from the terminal structure and the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

Cooled electrical terminal assembly and device incorporating same

Power converter having improved EMI shielding

A terminal structure for vehicle drive power electronics circuits reduces the need for a DC bus and thereby the incidence of parasitic inductance. The structure is secured to a support that may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as by direct contact between the terminal assembly and AC and DC circuit components. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.

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Brookfield, WI, United States of America

Mark G Phillips