Dow Global Technolgoies LLC

Mark G Hofius

Yushan Hu

Jeffrey E Bonekamp

John A Naumovitz

Lih-Long Chu

Nichole E Nickel

Disclosed are multilayer film structures including a layer (B) that includes a crystalline block copolymer composite (CBC) or a specified block copolymer composite (BC), including i) an ethylene polymer (EP) including at least 80 mol % polymerized ethylene; ii) an alpha-olefin-based crystalline polymer (CAOP) and iii) a block copolymer including (a) an ethylene polymer block including at least 80 mol % polymerized ethylene and (b) a crystalline alpha-olefin block (CAOB); and a layer C that includes a polyolefin having at least one melting peak greater than 125 C, the top facial surface of layer C in adhering contact with the bottom facial surface of layer B. Such multilayer film structure preferably includes (A) a seal layer A having a bottom facial surface in adhering contact with the top facial surface of layer B. Such films are suited for use in electronic device (ED) modules including an electronic device such as a PV cell.

Multilayered polyolefin-based films having a layer comprising a crystalline block copolymer composite or a block copolymer composite resin

A multilayer film structure including a top encapsulation layer A, a tie Layer B between top Layer A and bottom Layer C and a bottom layer C, the multilayer film structure characterized in that tie Layer B includes a crystalline block composite resin or a block composite resin and bottom Layer C includes a polyolefin having at least one melting point greater than 125 C.

Multilayered polyolefin-based films having an integrated backsheet and encapsulation performance comprising a layer comprising crystalline block copolymer composite or block copolymer composite

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Midland, MI, United States of America

Mark G Hofius