Molex Corporation

Amphenol Corporation

Mark G Hanrahan

Mark W Gailus

James T Roberts

Prescott B Atkinson

John Kiezulas

Chansy Phommachanh

An improved open pin field connector is provided for enhanced performance when carrying high speed signals by selective application of one or more techniques for controlling electrical performance parameters. Lossy material may be positioned adjacent to conductive elements of the connector so as to reduce resonance in pairs of conductive elements and/or to provide a desired characteristic impedance for pairs of differential signal conductors. The lossy material may be shaped and positioned to avoid capacitive coupling that might otherwise increase cross talk. In a right angle connector, the lossy material may have a step-wise increase in thickness to provide comparable loss along longer and shorter conductive elements. Conductive elements may be shaped to balance performance characteristics of pairs selected to carry differential signals regardless of orientation along a row or column. Alternatively, conductive elements may have narrowed regions, covered with lossy portions, for reducing resonance while supporting DC signal propagation.

High bandwidth connector

A terminal module is provided, such as for use in a modular jack assembly. The module includes a dielectric body having a pair of body halves with opposing faces. A plurality of terminals have mounting portions embedded in the opposing faces of the body halves. The terminals are securely captured in the dielectric body when the mounting portions are sandwiched between the body halves.

Modular jack assembly

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Milford, NH, United States of America

Mark G Hanrahan