International Business Machines Corporation

Mark G Courtney

Lewis Sigmund Goldmann

Raymond A Jackson

Hilton T Toy

Peter Jeffrey Brofman

Kathleen Ann Stalter

Gregory Blair Martin

David L Edwards

Sushumna Iruvanti

Raed A Sherif

William Edward Sablinski

Shaji Farooq

Patrick Anthony Coico

Frank Louis Pompeo

Gaetano Paolo Messina

Gregory Scott Hopper

Albert Joseph Fahey

Charles Frederick Jones

Sudipta Kumar Ray

David C Linnell

Li Ming Wang

Michael J Ellsworth, Jr

Charles Hampton Perry

Mario John Interrante

Jeffrey Thomas Coffin

Armando S Cammarano

Stephen S Drofitz, Jr

Benjamin V Fasano

Anson Jay Call

Mukta S Farooq

James H Covell

Stephen Anthony DeLaurentis

Allen J Arnold

Kerry L Sutton

Katherine H Mis

Diane N Kirby

A method of forming an electrical connection between two devices is disclosed. In an exemplary embodiment of the invention, the method includes soldering a second solderable cap of an interconnection to a first contact pad of a first component. The interconnection further includes a conductive polymer comprising a polymer component and a conductive component A first solderable cap is disposed in contact with the conductive polymer, and the second solderable cap is disposed in contact with the conductive polymer opposite the first solderable cap. The first solderable cap is then soldered to a second contact pad of a second component.

Conductive polymer interconnection configurations

A method and a structure for assembling a circuit board whereby high temperature attach devices can be electrically tested prior to the joining of permanent low temperature attach devices. A test interposer, with low temperature attach known good reference devices, is placed in electrical contact with the circuit board containing high temperature attach devices. The test interposer/circuit board assembly can be used to identify any defective high temperature attach devices which can be replaced prior to joining the permanent low temperature attach devices on the circuit board. This partial interim test, when only the high temperature attach devices are mounted on the circuit board, eliminates the need to remove known good low temperature attach devices from the circuit board during the high temperature attach device rework process.

Method and apparatus for interim assembly electrical testing of circuit boards

Disclosed herein is an interconnection for electrical connection of two electrical devices. The interconnection comprises a conductive polymer disposed in contact with one or two solderable caps. Together, the solderable cap(s) and the conductive polymer form an interconnection that can be used to connect two electrical devices through the contact pads on the electrical devices. For example, a packaged integrated circuit chip can be connected to a &ldquo;card&rdquo; using an array of the interconnections. Since the interconnection has solderable surfaces, the interconnect can be used in place of solder balls in a conventional manufacturing line.

The present invention relates generally to an electrical interconnection package and a method thereof. More particularly, the invention encompasses an invention that increases the fatigue life of a Ball Grid Array (BGA) electrical interconnection. This invention structurally couples at least one module to an organic interposer using a high modulus underfill material. The organic interposer is then joined to a organic board using standard joining processes. The inventive module can then be removed from the organic board at any time by moving the organic interposer using standard rework techniques.

Electrical interconnection package and method thereof

This invention relates to a solder structure which provides enhanced fatigue life properties when used to bond substrates particularly at the second level such as BGA and CGA interconnections. The solder structure is preferably a sphere or column and has a metal layer wettable by solder and the structure is used to make solder connections in electronic components such as joining an electronic module such as a chip connected to a MLC which module is connected to a circuit board. The solder structure preferably has an overcoat of solder on the metal layer to provide a passivation coating to the metal layer to keep it clean from oxidation and corrosion and also provide a wettable surface for attachment of the solder structure to solder on the pads of the substrate being bonded.

Method for enhancing fatigue life of ball grid arrays

A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.

Solder disc connection

A method and apparatus is provided for forming an elongated solder joint between two soldered substrates of an electronic module by applying a controlled separating force between the two soldered substrates during and/or after heating of the module. The solder joints are plasticized, preferably to the molten state above the liquidus temperature, and are thereby stretched and the module is then cooled to solidify the stretched joints. An apparatus and method are provided which preferably uses a vacuum device as the separating force to stretch the existing solder joints to the desired solder height and configuration which is preferably an hour-glass shape.

Ceramic ball grid array using in-situ solder stretch

A method and apparatus are provided for forming an elongated solder joint between two soldered substrates of an electronic module or an electronic module in the process of being fabricated by using expandable solder bump means disposed between the substrates. The expandable solder bumps means comprise solder having a higher reflow temperature than the solder used to join the substrates and expansion means such as a compressed spring encased within the solder and are activated (expanded) by reflowing at a higher temperature than the melting point temperature of the solder joints.

Enhanced ceramic ball grid array using in-situ solder stretch with spring

A device is provided for stretching solder interconnection joints between two substrates of an electronic module. The device employs an expandable metal to exert a separating (stretching) force to the two substrates whereby a lifting rod attached to a clamping bridge is cause to move upwards by expansion of the expandable metal raising a first substrate clamped thereto. A lifting bridge in connection with the clamping bridge is caused to move downward to maintain the lifting bridge in contact with the second substrate being interconnected to the first substrate.

Enhanced ceramic ball grid array using in-situ solder stretch with clip

The present invention relates generally to a new scheme of providing a seal band for semi-conductor substrates and chip carriers. More particularly, the invention encompasses a structure and a method that uses a multi-layer metallic seal to provide protection to chips on a chip carrier. This multi-layer metal seal provides both enhanced hermeticity lifetime and environmental protection. For the preferred embodiment the multi-layer metallic seal band is a three layer, solder sandwich structure which is used to create a low cost, high reliability, hermetic seal for the module. This solder sandwich has a high melting temperature thick solder inner core, and lower melting point thin interconnecting solder layers, where the thin interconnecting solder layers may have similar or different melting points.

Multi-layer solder seal band for semiconductor substrates

Multi-layer solder seal band for semiconductor substrates and process

The present invention relates generally to a new apparatus and method for customized cooling of chips. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by varying the depth of thermal compound filled gap or the blind hole that is above each chip.

Method for cooling of chips using blind holes with customized depth

Growing community of inventors

Poughkeepsie, NY, United States of America

Mark G Courtney