Saluda Medical Pty Limited

Mark Fretz

David Robinson

David Thomas

John Louis Parker

John Luis Parker

The present invention relates to active implantable medical stimulation devices. An active implantable medical stimulation device comprises an electrically non-conductive support member, one or more electrically conductive stimulation electrodes disposed on the support member and a cover covering the support member and the one or more electrodes. At locations where the cover covers the electrodes, the cover comprises one or more openings dimensioned such that the one or more openings which facilitate electrical conduction to allow stimulation of tissue and/or measurement of electrical signal s by the electrodes while preventing tissue ingrowth. The support member can be of an advantageous structure, that would not be usable without the cover since tissue in-growth would not allow the removal of the implant. At the same time, the cover still allows the stimulation of the tissue so that the functionality of the device is not prevented by the cover.

Coatings for active implantable medical devices

Methods of forming a feedthrough using a mold that defines a cavity when closed and includes one or more cores configured to move in and out of the mold cavity. The methods include injecting non-electrically conductive powder injection molding (PIM) feedstock into the mold cavity to form an insulative body around a portion of each of the cores disposed in the mold cavity, removing each of the cores from the insulative body to form one or more core cavities in the insulative body, injecting electrically conductive PIM feedstock into the core cavities to form one or more conductors in the core cavities, respectively, and sintering the insulative body and the conductors to form the feedthrough.

Forming feedthroughs for hermetically sealed housings using two-material powder injection molding

Methods of forming feedthroughs for hermetically sealed housings using powder injection molding, including positioning a plurality of separate electrically conductive elements in a mold, injecting non-electrically conductive powder injection molding (PIM) feedstock into the mold to form a plurality of insulative bodies around the conductive elements, sintering the insulative bodies to form the plurality of feedthroughs physically connected to one another via the conductive elements; and severing the conductive elements between neighboring insulative bodies.

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Alexandria, Australia

Mark Fretz