Growing community of inventors

Essex Junction, VT, United States of America

Mark F Chadurjian

Average Co-Inventor Count = 14.01

ph-index = 2

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 176

Mark F ChadurjianJames Gardner Ryan (2 patents)Mark F ChadurjianSudipta Kumar Ray (2 patents)Mark F ChadurjianKamalesh K Srivastava (2 patents)Mark F ChadurjianErick G Walton (2 patents)Mark F ChadurjianBirendra N Agarwala (2 patents)Mark F ChadurjianPaul A Totta (2 patents)Mark F ChadurjianArthur Bross (2 patents)Mark F ChadurjianKarl J Puttlitz, Sr (2 patents)Mark F ChadurjianNicholas G Koopman (2 patents)Mark F ChadurjianAziz M Ahsan (2 patents)Mark F ChadurjianAdolf E Wirsing (2 patents)Mark F ChadurjianJoseph G Schaefer (2 patents)Mark F ChadurjianLi-Chung Lee (2 patents)Mark F ChadurjianMark F Chadurjian (2 patents)James Gardner RyanJames Gardner Ryan (53 patents)Sudipta Kumar RaySudipta Kumar Ray (51 patents)Kamalesh K SrivastavaKamalesh K Srivastava (38 patents)Erick G WaltonErick G Walton (27 patents)Birendra N AgarwalaBirendra N Agarwala (21 patents)Paul A TottaPaul A Totta (20 patents)Arthur BrossArthur Bross (18 patents)Karl J Puttlitz, SrKarl J Puttlitz, Sr (16 patents)Nicholas G KoopmanNicholas G Koopman (11 patents)Aziz M AhsanAziz M Ahsan (10 patents)Adolf E WirsingAdolf E Wirsing (9 patents)Joseph G SchaeferJoseph G Schaefer (6 patents)Li-Chung LeeLi-Chung Lee (6 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. International Business Machines Corporation (2 from 164,108 patents)


2 patents:

1. 5251806 - Method of forming dual height solder interconnections

2. 5130779 - Solder mass having conductive encapsulating arrangement

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