Honeywell International Inc.

Bardahl Manufacturing Corporation

Honeywell G.m.b.h.

Mark Eskridge

Michael R Foster

Mark S Williams

Galen P Magendanz

Ijaz H Jafri

David L Malametz

Shifang Zhou

Gary J Ballas

Michael J Foster

Arthur J Kiehn

Peter L Cousseau

James Christopher Milne

Hugh A McNeil

Matt Loesch

A stress isolator that allows a sensor to be attached to materials of the same coefficient of thermal expansion and still provide the required elastic isolation between the sensor and the system to which it is mounted. The isolator is made of two materials, borosilicate glass and silicon. The glass is the same material as the mounting surface of the microelectromechanical system (MEMS) sensors. The silicon makes an excellent isolator, being very elastic and easy to form into complex shapes. The two materials of the isolator are joined using an anodic bond. The construction of the isolator can be specific to different types of MEMS sensors, making the most of their geometry to reduce overall volume.

Anodically bonded strain isolator

One method of the present invention includes preparing a die with traces and pads as desired for the intended use of the die. A MEMS device is mounted to the die. The die is then mounted to a substrate of the same material as the die. The substrate is then mounted to a package. The die and/or the substrate may be flip-chip mounted.

Die mounting stress isolator

A method of fabricating a semiconductor comprises forming a plurality of stud bumps in a pattern having a geometrical shape on a surface of a substrate, the pattern defining a periphery of a bonding area on the surface of the substrate, and placing a solder material in the bonding area such that the solder material is surrounded by the stud bumps. The solder material is heated to a temperature where the solder material begins to flow within the bonding area. A bonding surface of a die is pressed onto the stud bumps with a sufficient pressure to crush the stud bumps a predetermined extent such that the solder material substantially evenly spreads between the stud bumps within the bonding area. The solder material is then solidified to form a final solder area that conforms to the geometrical shape of the pattern of stud bumps.

Controlled area solder bonding for dies

An annealed platinum free air ball is bonded to a first contact and to a second contact. The bonding work hardens the platinum so that a work hardened platinum ball is resistant to temperature induced creep.

Systems and methods for platinum ball bonding

Systems and methods for conductive pillars are provided. In one embodiment, a system comprises an electrical board comprising an electrical device, and a packaged die, the packaged die bonded to the electrical board. The packaged die comprises a substrate layer, the substrate layer comprising a recessed area, a conductive trace, wherein a portion of the conductive trace is formed in the recessed area, and an epitaxial device layer bonded to the substrate layer. The device layer comprises a MEMS device, and an epitaxial conductive pillar, wherein a first side of the epitaxial conductive pillar is electrically connected to the conductive trace and the second side of the epitaxial conductive pillar is electrically connected to the electrical board, wherein the epitaxial conductive pillar extends through the epitaxial device layer to electrically couple the conductive trace to an interface surface on the epitaxial device layer.

Systems and methods for conductive pillars

Methods of anchoring components of a Micro-Electro-Mechanical Systems (MEMS) device to a substrate. An exemplary embodiment has a trace anchor bonded to a substrate, a device anchor bonded to the substrate, and an anchor flexure configured to flexibly couple the trace anchor and the device anchor to substantially prevent transmission of a stress induced in the trace anchor from being transmitted to the device anchor.

Methods for reduced stress anchors

Microelectromechanical system (MEMS) devices and methods with controlled die bonding areas. An example device includes a MEMS die having a glass layer and a protective package. The glass layer includes a side facing the protective package with at least one mesa protruding from a recessed portion of the glass layer. The at least one mesa is attached to the protective package. An example method includes creating at least one mesa on a glass layer of a MEMS die and attaching the at least one mesa to a protective package.

MEMS devices and methods with controlled die bonding areas

Systems and methods for mounting inertial sensors on a board. On a wafer containing one or more sensor packages having a substrate layer, a sensor layer and an insulator layer located between the sensor layer and the substrate layer, a V-groove is anisotropically etched into one of the substrate layer. The substrate layer is in the 100 crystal plane orientation. The sensor package is then separated from the wafer. Then, a surface of the substrate layer formed by the etching is attached to a board. In one example, three sensor packages are mounted to the board so that their sense axis are perpendicular to each other.

Systems and methods for mounting inertial sensors

A discrete stress isolation apparatus for a Micro Electro-Mechanical System (MEMS) inertial sensor device having a mechanism die and a package. A capacitive device mechanism is formed in a substrate layer positioned between the mechanism die and package substrate. A discrete stress isolation structure is formed in the same substrate layer with but physically separated from the capacitive device mechanism. The discrete stress isolation structure is interposed between the mechanism die and the package substrate and provides the mechanical and electrical attachment therebetween.

Discrete stress isolator attachment structures for MEMS sensor packages

Anchor systems and methods anchor components of a Micro-Electro-Mechanical Systems (MEMS) device to a substrate. An exemplary embodiment has a trace anchor bonded to a substrate, a device anchor bonded to the substrate, and an anchor flexure configured flexibly couple the trace anchor and the device anchor to substantially prevent transmission of a stress induced in the trace anchor from being transmitted to the device anchor.

Systems and methods for reduced stress anchors

A Micro-ElectroMechanical Systems (MEMS) device having electrical connections (a metallization pattern) available at an edge of the MEMS die. The metallization pattern on the edge of the die allows the die to be mounted on edge with no further packaging, if desired.

Silicon tab edge mount for a wafer level package

A Micro ElectroMechanical Systems device according to an embodiment of the present invention is formed by dicing a MEMS wafer and attaching individual MEMS dies to a substrate. The MEMS die includes a MEMS component attached to a glass layer, which is attached to a patterned metallic layer, which in turn is attached to a number of bumps. Specifically, the MEMS component on the glass layer is aligned to one or more bumps using windows that are selectively created or formed in the metallic layer. One or more reference features are located on or in the glass layer and are optically detectable. The reference features may be seen from the front surface of the glass layer and used to align the MEMS components and may be seen through the windows and used to align the bumps. As an end result, the MEMS component may be precisely aligned with the bumps via optical detection of the reference features in the glass layer.

MEMS devices and methods of assembling micro electromechanical systems (MEMS)

A device according to the present invention includes a MEMS device supported on a first side of a die. A first side of an isolator is attached to the first side of the die. A package is attached to the first side of the isolator, with at least one electrically conductive attachment device attaching the die to the isolator and attaching the isolator to the package. The isolator may include isolation structures and a receptacle.

Mechanical isolation for MEMS devices

An apparatus and method for a near hermetic chip carrier package having a base die and a lid die each formed of a substantially impermeable material and conjoined by a semi-permeable sheet or tape substrate of only a few thousands of an inch thickness that is formed of two or more thermotropic liquid crystal polymer (LCP) films laminated over a selected number of metal electrical conductors carrying signals into and out of package.

MEMS device seal using liquid crystal polymer

An hermetic, gas filled or vacuum package device and method of making a vacuum package device. The device includes a device layer having one or more Micro Electro-Mechanical Systems (MEMS) devices. The device layer includes one or more electrical leads coupled to the one or more MEMS devices. The device also includes a first wafer having one or more silicon pins, wherein a first surface of the first wafer is bonded to a first surface of the device layer in such a manner that the one or more silicon pins are in electrical communication with the electrical leads. A second wafer, which may also have one or more silicon pins, is bonded to a second surface of the device layer. The first and second wafers are formed of borosilicate glass and the device layer is formed of silicon.

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Renton, WA, United States of America

Mark Eskridge