International Business Machines Corporation

Lenovo (singapore) Pte. Ltd.

Mark Edward Steinke

Vinod Kamath

Madhusudan K Iyengar

Jason Aaron Matteson

Roger R Schmidt

David P Graybill

Bejoy J Kochuparambil

Timothy Joseph Chainer

Michael Sean June

Chunjian Ni

Derek Ian Schmidt

James Scott Womble

Richard M Barina

Howard V Mahaney, Jr

Aparna Vallury

Christopher J Hardee

Michael A Gaynes

Mark Delorman Schultz

Brian Michael Kerrigan

Patrick Anthony Coico

Michael A Boraas

Jamil A Wakil

Daniel P Simco

Gary David Cudak

Milnes P David

Pritish Ranjan Parida

Edward Stanely Suffern

Eric Alan Eckberg

Shareef Fathi Alshinnawi

Michael Raymond Miller

Gerhard Ingmar Meijer

J Mark Weber

Gregory Joseph McKnight

Michael Sven Miller

Randolph Scot Kolvick

Edward John McNulty

Thomas Dixon Pahel, Jr

William M Megarity, Jr

Troy Williams Glover

Leo Harold Webster, Jr

Whitcomb Randloph Scott, Iii

Kevin M Cash

Michael S Purdy

Dana S Royer

A cooling assembly for cooling a processor includes a heat sink base defining a first area and a second area, a plurality of heat sink fins extending from the first area, a thermoelectric cooling module having a cold side and hot side, wherein the cold side is in contact with the second area, and a heat sink module in contact with the hot side. In use, a method includes monitoring a processor parameter selected from processor power consumption and processor temperature, and causing airflow across the plurality of heat sink fins and the heat sink module. The method further includes powering on the thermoelectric cooling module in response to the processor parameter having a value greater than a first threshold value, and powering off the thermoelectric cooling module in response to the processor parameter having a value less than a second threshold value.

Hybrid passive and active cooling assembly

The embodiments described herein relate to generating fluid flow. A pump is positioned adjacent to a heat source. The pump includes a primary chamber having a primary rotational element configured to rotate on an axis, and a secondary chamber having a secondary rotational element configured to rotate on the axis, with a heat transfer element positioned between the primary chamber and the secondary chamber. The primary rotational element is coupled with the secondary rotational element along the axis. A primary fluid is received in the primary chamber with a primary fluid flow, which rotates the primary rotational element. A secondary fluid flow is generated in the secondary chamber by the primary rotational element causing a rotation of the secondary rotational element on the axis.

Harvesting facility water for pumping secondary fluid flow

Method for transferring files to a destination folder on a computer. At least one rule to a transfer of files to a destination folder on a destination computer system are received. A filter file is generated, wherein the filter file includes the least one rule specific to the transfer of files to the destination folder. During transfer of files to the destination folder on the destination computer, attributes of each file are compared to the at least one rule specific to the transfer of files to the destination folder. Upon attributes of a compared file violating a rule of the at least one rule specific to the transfer of files to the destination folder, transfer of the violating file to the destination folder is prevented.

File filter

Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader

Methods, apparatuses, and computer program products for forming an overmolded dual in-line memory module (DIMM) cooling structure are provided. Embodiments include identifying, by a tagging module, contextual information indicating circumstances in which the photograph was taken; based on the contextual information, selecting, by the tagging module, candidate profiles from a plurality of friend profiles associated with a profile of a user; and suggesting, by the tagging module to the user, the selected candidate profiles as potential friends to tag in the photograph.

Overmolded dual in-line memory module cooling structure

Methods are provided for facilitating cooling of an electronic component. The methods include providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component

Systems, apparatuses, and methods are disclosed for heat management in a server rack. A server rack includes devices and a direct cooling element. A door coupleable to the server rack includes fluid-conducting conduits. An intake hose is coupled to a first fluid-conducting conduit and a fluid supply. The intake hose is coupleable to a fluid supply located below and above the server rack. An intermediate hose is coupled to a second fluid-conducting conduit and the direct cooling element. A return hose is coupled to a fluid return line and the direct cooling element. The return hose is coupleable to a fluid return line located below and above the server rack. The intake hose, the fluid-conducting conduits, the intermediate hose, the direct cooling element, and the return hose are connected to create a single path for the fluid.

Heat management in a server rack

A heat sink comprises a first thermally conductive base having a first face to thermally engage a heat-generating electronic component and a second thermally conductive base with a plurality of fins on a first face and a second face to engage the first base. The fins on the second base are positionable in either of two orientations relative to the heat-generating electronic component to which the heat sink is coupled. The fins are selectively placed in the orientation that best utilizes the direction of air flow available to the heat sink. The orientable fins of the heat sink afford flexibility in arranging the heat-generating electronic component on a circuit board or in arranging a circuit board within a computer chassis.

Heat sink with orientable fins

Water is circulated through a cooling system within a compute node to remove heat from a heat-generating component within the compute node. Water leakage from the cooling system is collected into a containment reservoir within the compute node. A rate of the water leakage is measured, a temperature of the compute node is measured, a rate of water evaporation from the containment reservoir is determined based upon the measured temperature, and the rate of water leakage is compared to the rate of water evaporation to determine whether water is accumulating in the containment reservoir. A period of time before the containment reservoir reaches a critical level may also be determined.

Managing water leakage from a water cooling system within a compute node

A system includes a chassis, a plurality of nodes, a coolant distribution unit (CDU), and one or more air movers. The chassis includes multiple node bays, a CDU bay, a coolant supply manifold with an inlet in the CDU bay and an outlet in each node bay, and a coolant return manifold an inlet in each node bay and an outlet in the CDU bay. Each node is received into a node bay with an internal heat exchanger connected between a coolant supply and return manifolds. The CDU is received in the CDU bay and includes an air-to-coolant heat exchanger in fluid communication between the supply and return manifolds, and a pump for circulating a coolant through a coolant loop. The one or more air movers force air across the air-to-coolant heat exchanger of the CDU.

Coolant distribution unit for a multi-node chassis

A fastening device is disclosed. The fastening device has a vertical protrusion for fastening. A horizontal portion and an indicator are used for seating. The horizontal portion extends from the vertical protrusion for providing a clue to indicate that the fastening device is seated correctly. In embodiments, the clue is a color or a texture. In embodiments, a bellow is used with elastomeric properties. When the right load and torque are applied, the bellow covers the horizontal portion such that the color and/or texture of a perspective directed at the horizontal portion appear to be changed.

Fastening device

Growing community of inventors

Durham, NC, United States of America

Mark Edward Steinke