Avery Dennison Corporation

Mark E Polasky

Ramabhadran Balaji

The invention is an in-mold label film comprising at least two layers with one layer being a heat seal layer for bonding the film to a polymer substrate wherein the film has a thermal conductivity of less than about 1.250.times.10.sup.-4 k-Cal/sec cm .degree. C. The invention further includes a process for in-mold labeling comprising the steps of forming a label comprising at least two layers with one layer being a heat seal layer for bonding the film to a plastic substrate wherein the film has a thermal conductivity of less than about 1.250.times.10.sup.-4 k-cal/sec cm .degree. C. inserting the label into a mold for producing the plastic substrate with a inside and outside surface thereafter forming a plastic substrate in the mold with sufficient heat wherein the outside surface of the substrate bonds with the heat seal layer of the label.

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Willoughby, OH, United States of America

Mark E Polasky