Lsp Technologies, Inc.

Furon Company

Sunrise International, Inc.

Sokol, David

Glover, Keith

Dulaney, Jeff

May, Gary

O'loughlin, Mark E.

Mark E O'Loughlin

Allan H Clauer

David W Sokol

Jeffrey L Dulaney

Jeff L Dulaney

Steven M Toller

Craig Thompson Walters

David F Lahrman

Harold M Epstein

Gary May

Keith Glover

Steven E Dykes

Richard P Heggs

Lucy Melamud

Jeff Dulaney

An apparatus may include a diode-pumped solid-state laser oscillator configured to output a pulsed laser beam, a modulator configured to modify an energy and a temporal profile of the pulsed laser beam, and an amplifier configured to amplify an energy of the pulse laser beam. A modified and amplified beam to laser peen a target part may have an energy of about 5 J to about 10 J, an average power (defined as energy (J)×frequency (Hz)) of from about 25 W to about 200 W, with a flattop beam uniformity of less than about 0.2. The diode-pumped solid-state oscillator may be configured to output a beam having both a single longitudinal mode and a single transverse mode, and to produce and output beams at a frequency of about 20 Hz.

Method and apparatus for use in laser shock peening

An apparatus may include a diode-pumped solid-state laser oscillator configured to output a pulsed laser beam, a modulator configured to modify an energy and a temporal profile of the pulsed laser beam, and an amplifier configured to amplify an energy of the pulse laser beam. A modified and amplified beam to laser peen a target part may have an energy of about 5 J to about 10 J, an average power (defined as energy (J)&#xd7;frequency (Hz)) of from about 25 W to about 200 W, with a flattop beam uniformity of less than about 0.2. The diode-pumped solid-state oscillator may be configured to output a beam having both a single longitudinal mode and a single transverse mode, and to produce and output beams at a frequency of about 20 Hz.

Methods, systems, and apparatuses are disclosed for the protection of optical components used during laser bond inspection. In one embodiment, an optic surface wetting enhancement is provided on a protective optic to assist in forming a substantially flat film of transparent liquid from transparent liquid applied to a surface of a protective optic. A flat film of transparent liquid on a surface of a protective optic may be used to retain debris and effluent backscatter produced during a laser bond inspection process.

Protection of laser bond inspection optical components

A method of controlling the application of laser peening overlays on the surface of a workpiece to reduce the variability of shock waves generated therein, comprises applying an energy-absorbing overlay to a portion of the surface of a workpiece, measuring the thickness of the energy-absorbing overlay in at least one location on the energy-absorbing overlay, applying a transparent overlay material over the energy-absorbing overlay, measuring the thickness of the transparent overlay in at least one location on the transparent overlay, determining if the measured values for each overlay is within a specified range, and directing a pulse of coherent energy to the workpiece to create a shock wave therein when the measured values are within the specified range.

Overlay control for laser peening

An image processing system for monitoring a laser peening process includes a laser peening system having a workpiece positioner and a system controller. A video camera is utilized for forming an electronic image of at least a portion of a workpiece. An image processing computer is connected to the video camera, and the laser peening controller includes a program to determine a position of the workpiece.

Image processing for laser shock processing

A method and apparatus for quality control of laser shock processing. The method includes measuring emissions and characteristics of a workpiece when subjected to a pulse of coherent energy from a laser. These empirically measured emissions and characteristics of the workpiece are correlated to theoretical shock pressure, residual stress profile, or fatigue life of the workpiece. The apparatus may include a radiometer or acoustic detection device for measuring these characteristics.

Quality control plasma monitor for laser shock processing

A method of testing the operation of a laser peening system includes providing a sensor in a possible laser beam path, applying a transparent overlay material to the sensor, directing a pulse of coherent energy to the sensor through the transparent overlay material to create a shock wave, and determining a characteristic of the created shock wave with the sensor.

Quality control for laser peening

A method of producing a workpiece involves positioning the workpiece at a current processing position indicated by a hard-coded part program and then collecting position data which defines the positional arrangement of a current target area of the workpiece. The collected position data is processed by comparing it to reference position information that represents the positional arrangement of the same target area in an ideal workpiece employed in the development of the part program. The position of the workpiece (and hence the target area) is adjusted in accordance with the comparison results. A laser shock processing operation is performed on the workpiece at the current target area following the position adjustment step.

Method of positioning a workpiece for optimal processing

Image processing for laser peening

An apparatus creating a processing cell for laser peening operations includes an enclosure which substantially defines a work cell or processing cell with a transparent overlay material applicator disposed therein. A cleaning system is utilized that may include a vapor exhaust, liquid removal system, and a gas or air supply. A vapor exhaust system is connected to the enclosure for removing vapor from within the processing cell. A liquid removal system is connected to the enclosure for removing liquid from the processing cell. A gas or air supply is connected to the enclosure to flood the enclosure with gas or air to flush airborne debris therefrom. A workpiece manipulator may be disposed or operate within the cell for moving workpieces therein.

Process chamber for laser peening

An apparatus creating a processing cell for laser peening operations includes an enclosure which substantially defines a work cell or processing cell with a transparent overlay material applicator located therein. A cleaning system is utilized that may include a vapor exhaust, liquid removal system, and a gas or air supply. A vapor exhaust system is connected to the enclosure for removing vapor from within the processing cell. A liquid removal system is connected to the enclosure for removing liquid from the processing cell. A gas or air supply is connected to the enclosure to flood the enclosure with gas or air to flush airborne debris therefrom. A workpiece manipulator may be disposed or operate within the cell for moving workpieces therein.

A temperature sensing system for over-heat detection includes a temperature sensing cable, interface unit and termination unit. The interface unit is configured to issue interrogation, communication and power signals to the termination unit through the temperature sensing cable. During normal operation issuance of the interrogation signal results in no reflection pulses, as the signal is dissipated through the termination resistance in the termination unit. When an over-heat, short circuit or open circuit condition exists, a reflected pulse is detected by the interface unit and this information is used to determine the type and location of the condition. The interface unit is also configured to supply power to the termination unit which in turn is stored in the termination unit to power its operations, including setting of the resistor values. The termination unit is used as an instrument of calibration in the subject system.

Growing community of inventors

Galloway, OH, United States of America

Mark E O'Loughlin