Augat Inc.

Mark E Lewis

Jay T Goff

Wayne Stewart Alden, Iii

David W Mendenhall

Gregory J Smith

Michael J Bellomo

A circuit card interface system of minimized vertical clearance, capable of interfacing one or more circuit cards to a relatively small space on a mother board. The interface system includes an interfacing connector assembly and at least one stacking connector assembly, each adapted to receive a circuit card. The conductors of the interfacing connector assembly are coupled to a substrate such as a mother board. The interfacing connector assembly can be used alone or with one or more electrically interconnected stacking connector assemblies. Rapid electrical attachment of each stacking connector assembly is accomplished by mating a cooperating portion of the stacking connector assembly with a portion of the underlying interfacing connector assembly. A separable header connector assembly 204 is attachable to a metal frame 202 comprising rails for receiving the circuit card. The separable header is attached via a metal latch with an opening 224 that engages a plastic boss 222. A center mounted ejection lever mechanism facilitates removal of the installed circuit card. The ejection lever mechanism includes a reversible ejection lever 206 and push arm 210 which, in conjunction with symmetrical rails 212, 214 , enables left or right hand mounting of the ejection lever.

Circuit card interface system

A compressible retention element of a diameter slightly greater than that of a cooperating cavity, having a low ratio of insertion to withdrawal forces. The retention element further provides insertion and withdrawal forces reduced from that found in the prior art. One embodiment of the retention element includes a cylindrical body, manufactured of a pliant material such as plastic or the like, having a wedge-shaped groove disposed axially along its length on one side and a planar region disposed axially along its length on an opposite side.

Interconnection retention device

A high density land grid array test socket comprises a leadless component contact socket assembly and a fixture. The contact socket assembly can be assembled with a variety of contact terminal end configurations and adapted for a desired mode of circuit board interface. In one embodiment, the test socket fixture includes a latching mechanism and a hinged lid assembly which allow quick and reliable manual installation of a device under test (DUT). An alternative embodiment includes snap latches, extension springs and alignment bushings which permit robotically controlled insertion and removal from the test socket. A bias clip or spring is incorporated in the test sockets for assuring proper alignment of the chip carrier with the contact socket assembly. The test socket creates reliable contacts with short electrical paths for low signal distortion and reduced chip loading.

High density grid array test socket

The invention provides a socket for substrates such as single in-line memory modules, circuit boards, and similar components which are inserted into and rotated into fixed position on the socket. The socket housing includes end portions having improved structural integrity for externally mounting cooperative latch elements. The external mounting permits a greater variety of latch sizes and configurations to suit operational requirements. An exemplary latch is preferably metal and comprises a mounting collar having a compliant C-section which corresponds to a latch-receiving section or member on the socket housing, a detent for clasping a memory module, and a resilient section connected therebetween for biasing the detent so that it clasps the memory module in fixed position in the socket. The latch collar is mounted onto the cooperative section of the socket end portion, and the latch is thereby disposed exteriorly on the socket body.

Growing community of inventors

Mansfield, MA, United States of America

Mark E Lewis