International Business Machines Corporation

Hitachi Global Storage Technologies Netherlands B.v.

Hitachi Global Technologies Netherlands B.v.

Mark Delorman Schultz

Timothy Joseph Chainer

Bucknell Chapman Webb

Pritish Ranjan Parida

Edward John Yarmchuk

John Peter Karidis

Shurong Tian

Todd Edward Takken

Madhusudan K Iyengar

Paul William Coteus

Anthony Paul Praino

Evan G Colgan

Fuad Elias Doany

Shawn Anthony Hall

Thomas J Brunschwiler

Roger R Schmidt

Joel Abraham Silberman

Gerd Schlottig

Chin Lee Ong

Arvind Raj Mahankali Sridhar

Michael A Gaynes

Russell Alan Budd

Glen Alan Jaquette

Milnes P David

William Louis Brodsky

Paul Stephen Andry

Leonard George Jesionowski

John G Torok

Shawn Michael Nave

Brian Gerard Goodman

Vinod Kamath

Jeffrey Allen Zitz

Michael Philip McIntosh

Raymond Yardy

Hien Phu Dang

Noah B Singer

Arun Sharma

Cornelia K Tsang

Kevin O'Connell

Mark Edward Steinke

Shawn Canfield

David P Graybill

Christopher Michael Marroquin

Yuet-Ying Yu

Bejoy J Kochuparambil

Fanghao Yang

Yuan Yao

German Alberto Chamorro

Harley C Witt

Leitao Chen

Daniel P Simco

Jeffrey Donald Gelorme

Jonathan Darrel Coker

Layne A Berge

Gerard McVicker

Satoshi Yamamoto

Daniel Michael Kuchta

Benjamin G Lee

Monty Montague Denneau

David Timothy Flynn

Gary Allan Herbst

Kai R Schleupen

Christian Wilhelmus Baks

Scott Arthur Thomas

Blake O Finstad

Ozgur Ozsun

Kishan K Kumbia

Diego Anzola

A cold plate apparatus that has an outlet plenum leading to an outlet opening includes an outlet transition that connects the outlet opening to the outlet plenum. The outlet transition defines a smoothly curving flow path from a direction along a long dimension of the outlet plenum, which is parallel to a plane defined by the outlet opening, to a direction along a centerline of the outlet opening, which is at an angle from the plane defined by the outlet opening. The outlet transition provides a smooth variation of cross-sectional area from the outlet plenum to the outlet opening.

Reduced pressure drop cold plate transition

An electronic assembly is provided. The electronic assembly may include an electronic module mounted to a laminate, a cooling apparatus directly above the module, a single thermal interface material positioned between and directly contacting the module and the cooling apparatus, and a rotating cover rotatably attached to a top frame secured to the laminate, wherein the rotating cover includes an open position and a closed position.

Rotating lid for module cooler

A cold plate apparatus includes walls that surround an active volume adjacent to an inlet plenum; the walls include an inlet opening at one end of a top side of the inlet plenum and a plenum opening between the inlet plenum and the active volume. Also included is a blocker that partially separates the inlet plenum from the active volume. The blocker is structurally configured to preferentially redirect flow from the inlet plenum into the active volume.

Cold plate with uniform plenum flow

An optical module includes an optoelectronic assembly and a heat spreader. The optoelectronic assembly includes a flat, rigid substrate, an array of electrical contacts positioned on a first portion of the substrate, and an optoelectronics assemblage that is electrically connected to the array of contacts and is positioned apart from the array of electrical contacts. The heat spreader is comprised of a thermally conductive material and comprises a second portion that is structurally connected to the first portion and a third portion that is thermally connected to the optoelectronics assemblage.

Co-packaged optical module

An electronic module assembly is provided. The electronic module assembly may include one or more processors mounted to a laminate, a top frame mounted to the laminate and surrounding the one or more processors, and a removable lid covering the one or more processors. The removable lid includes latches arranged along a perimeter of the removable lid, the latches engage with a lip of the top frame and secure the removable lid to the module assembly, and the removable lid can only be removed from the module assembly by releasing all of the latches.

Temporary removable module lid

A data center cooling system has an indoor portion wherein heat is absorbed from components in the data center, and an outdoor heat exchanger portion wherein outside air is used to cool a first heat transfer fluid (e.g., water) present in at least the outdoor heat exchanger portion of the cooling system during a first mode. When an appropriate time has been reached to switch from the first mode to a second mode, the outdoor heat exchanger portion of the data cooling system is switched to a second heat transfer fluid, which is a relatively low performance heat transfer fluid (compared to the first fluid). It has a second heat transfer fluid freezing point, lower than the first heat transfer fluid freezing point, and sufficiently low to operate without freezing when the outdoor air temperature drops below a first predetermined relationship with the first heat transfer fluid freezing point.

Data center coolant switch

A device can comprise a plurality of layers stacked and bonded on one another, wherein at least one layer of the plurality of layers comprises: a first active region comprising first pin portions positioned in a first planar arrangement; and a second active region comprising second pin portions positioned in a second planar arrangement, wherein the second planar arrangement is different from the first planar arrangement. The device can also comprise a conformable layer adjacent to at least one of the plurality of layers.

Variable pin fin construction to facilitate compliant cold plates

Methods and apparatus of forming a thermal interface with condensate are described. In an example, a device may be disposed in a test environment or a test apparatus. An amount of condensate may be accumulated on a heat sink to coat the heat sink with a layer of condensate. The coated heat sink may be disposed on the device, where the layer of condensate is directed towards the device, and the disposal of the coated heat sink causes the layer of condensate to spread among voids between the heat sink and the device to form a thermal interface that includes the condensate. A test may be executed on the device with the thermal interface comprising the condensate between the coated heat sink and the device.

Thermal interface formed by condensate

An assembled circuit board has a topology that defines positions, dimensions and power dissipation of components mounted to the circuit board, including a high power component and one or more low power components. A cold plate makes thermal contact to the high power component through a thermal interface material. A thermally conductive sheet overlays the circuit board and is formed to match the topology of the low power component or components. The sheet has a first portion that makes thermal contact with the cold plate and a second portion that overlays the low power component or components. The cold plate removes heat directly from the high power component and indirectly through the thermally conductive sheet from the low power component or components. The thermally conductive sheet conforms to the topology of the low power components either by preforming or by flexibility.

Mechanically flexible cold plates for low power components

A data processing system includes a first wafer comprising a plurality of first chips, and kerf and crack-stop structures around perimeters of the first chips, and a second wafer comprising a plurality second chips, a plurality of interconnect structures through a connection zone between the second chips, and a plurality of thru silicon vias, wherein the first wafer and the second wafer are bonded face-to-face such that the interconnect structures of the second wafer electrically connect adjacent chip sites of the first wafer and where a pitch of the chips on the first and second wafer are equal.

Wafer scale supercomputer

An apparatus includes a fin pack of parallel plates that protrude from a base, a lid attachable to the fin pack opposite the base, and a brazing material painted onto the lid only in a plurality of wettable regions. The lid is positioned against the fin pack, opposite the base, with portions of the plurality of regions contacting edges of the parallel plates. The lid is brazed to the fin pack without intrusion of the brazing material between the parallel plates. This is accomplished by obtaining a lid to be attached to a fin pack of parallel plates that protrude from a base, painting the lid with the brazing material only in a plurality of wettable regions, positioning the lid against the fin pack, opposite the base, with portions of the plurality of regions contacting edges of the parallel plates, and brazing the lid to the fin pack.

Pattern bonded finned cold plate

A method for controlling a cooling system based on a heat dissipation of an electronic module and an ambient air temperature includes determining a combination of individual controls on components of the cooling system that achieve a specific amount of cooling based on a cooling power relationship for the plurality of components, the heat dissipation of the electronic module and the ambient air temperature, and applying the individual controls to the plurality of components.

Energy efficiency based control for a cooling system

Techniques for integrating two-phase cooling into a microprocessor chip package lid are provided. In one aspect, a vapor chamber lid device includes: an evaporator plate; a condenser plate attached to the evaporator plate such that a cavity is formed between the evaporator plate and the condenser plate; a thermal insulation layer sandwiched between the evaporator plate and the condenser plate; and a working fluid enclosed within the cavity, wherein the working fluid partially fills the cavity. At least one heat-dissipating device can be placed in thermal contact with the evaporator plate via a thermal interface material. A method is also provided for forming the vapor chamber lid device.

Module lid with embedded two-phase cooling and insulating layer

A heat sink includes a plurality of layers being disposed substantially parallel with a surface of a heat source. The layers include a plurality of pin portions spaced apart from each other in a planar arrangement wherein the pin portions of the layers are stacked and bonded to form pin fins extending in a transverse direction relative to the heat source to sink heat. A compliant layer is disposed between the pin fins and a mechanical load. The compliant layer provides compliance such that the pin fins accommodate dimensional differences when interfacing with the heat source.

Compliant pin fin heat sink and methods

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Ossining, NY, United States of America

Mark Delorman Schultz