Avaya Inc.

Mark Dee Woolley

Jae Hong Choi

James Erin Evans

Matthew Gilhousen

Systems and methods can produce thermal images of the mounting of a thermally-enhanced integrated circuit (IC) upon a circuit board. The system includes a thermal imaging camera that is operable to image the thermal dissipation and/or conduction through the heat sink into a mounting pad on the substrate. In testing the thermally-enhanced IC, the substrate or IC is connected to a power source, and the IC is operated such that the IC begins to generate heat. As the heat is conducted or dissipated through the heat sink into the mounting pad, a thermal imaging camera can detect the heat conduction and/or dissipation through the heat sink into the substrate. If there are voids or other types of failures in the mounting of the IC, the thermal imaging camera can detect cooler or colder spots in the image.

Non-destructive thermal conductivity detection of solder voids

The present invention provides an image enhancer that can be applied to various materials during quality testing. The image enhancer is adapted to infiltrate cracks, crevices, fractures, fissures, and other faults, defects, or flaws in the material and provide an increased contrast for images taken by, for example, an X-ray imaging device.

Method to enhance X-ray and optical images and locate nano-scale cracks in electric devices and components

A pulse of heat or cold is applied and conducted transversely through a ball grid array device and a printed circuit board via a selected one of the solder joints between them. Heat diffused through the other solder joints is neutralized by a thermal bias shield. The shield is then removed and a thermographic image of the printed circuit board is taken. The process is repeated for each solder joint, and the images are compared to identify defective solder joints.

Testing BGA solder joints by localized pulsed-heat thermography

A tilt mechanism is provided for a communication device enabling the communication device to be placed at a desired angular position during use. The tilt mechanism includes a biasing member that allows the user to consistently and easily set the angular position of the phone and without collapse or shifting of the communication device to another position. In the preferred embodiments, the biasing member is in the form of a leaf spring that biases the movement of a user-controlled component for setting the desired angular position.

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Broomfield, CO, United States of America

Mark Dee Woolley