International Business Machines Corporation

Globalfoundries Inc.

Mark David Plucinski

Phillip V Mann

Sandra J Shirk/Heath

Joseph Paul Kuczynski

Timothy Jerome Tofil

Arvind Kumar Sinha

Kevin O'Connell

Tyler Jandt

Chelsie M Peterson

Robert E Meyer, Iii

Cary Huettner

Matthew Stephen Doyle

William Louis Brodsky

John Lee Colbert

Roger Duane Hamilton

Amanda Elisa Ennis Mikhail

Jason T Wertz

Sarah K Czaplewski

Amanda Elisa Mikhail

William C Miller

Thomas S Thompson

Arthur Kumar Sinha

An electronic component assembly includes a board having an electronic component, a connector mounted to the board and electrically connected to the electronic component and having an anchoring feature positioned on an exterior of the connector, and a card having another electronic component and a securing feature. The electronic component assembly also includes a movable member positioned on one of the connector or the card. The movable member is positioned in the securing feature and contacts the anchoring feature to secure the card in a seated position in the connector, or the anchoring feature includes the movable member and contacts the securing feature to secure the card in the seated position in the connector.

Card retention connector system

An electronic board assembly comprises a board comprising an electronic component and a connector mounted to the board and electrically connected to the electronic component. The connector is configured to receive an electronic card assembly, and the connector comprises an electrical contact and a friction contact. The electrical contact is configured to exert a first amount of force on the electronic card assembly when the electronic card assembly is being seated in the connector. The friction contact is configured to exert a second amount of force on the electronic card assembly when the electronic card assembly is being seated in the connector. The second amount of force is greater than the first amount of force.

A method and structure are provided for implementing manufacture of a printed circuit board (PCB) with one of an infrared (IR) reflective mask or a novel solder mask to minimize coefficient of thermal expansion (CTE) mismatch between PCB laminate and plated through hole (PTH) copper. At least one of an IR-reflective mask and a solder mask composition for use in IR reflow processes is created such that radiant heat is reflected away from the major portion of the PCB yet permitted to impinge upon the PTHs. The copper within the PTH expands due to radiant heating while the bulk laminate expansion is significantly reduced due to the reflected IR radiation. Consequently, the CTE mismatch is minimized and tensile strain of the copper in the PTH is reduced, providing enhanced reliability.

Implementing IR reflective mask to minimize CTE mismatch between laminate and PTH copper

Method and apparatus includes a chassis to house circuitry, the chassis having first and second surfaces and an air inlet. An airflow moving device may create an airflow in a first direction that is communicated to the chassis via the air inlet. A wall structure may have a height that extends up from a base of the wall structure in a second direction that is substantially perpendicular to the first direction of the airflow, where the base of the wall structure directly contacts the first surface and forms an elongated opening along a top surface of the wall structure and in between the second surface of the chassis. The airflow may flow over the top surface of the wall structure.

Airflow balancing assembly

An electric packaging including a board and a mechanical component attached to the board. The mechanical component includes a first end attached to the board, a second end opposite the first end, and a seat interposed between the first end and the second end. The mechanical component also includes an upper portion extending from the second end to the seat, the upper portion having a first width and a lower portion extending from the seat to the first end. The lower portion having a second width that is less than the first width. The electric packaging also includes a connector attached to the board. The connector includes a first surface attached to the board and a second surface located opposite the first surface. The second surface includes a plug connection area sized to receive a plug and located completely radially outside of the first width.

Offset ;lug connector on a board connection area

A heat transfer device includes a base and a heat sink coupled to the base. The heat sink includes a fin with a surface for receiving a cooling medium to travel across, thereby defining an upstream end and a downstream end for the fin. An airflow projection is coupled to the surface of the fin, in which the airflow projection includes an upstream end and a downstream end with the downstream end of the airflow projection cantilevered above the surface of the fin.

Airflow projection for heat transfer device

A method and system for a dynamic keying system is disclosed. The method and system can include a male connector device having a first plurality of settings for one or more key features, and a female connector device having a second plurality of settings for one or more key features. The female connector device can be configured to operate in an initial mode in which it is configured to, in response to the introduction of the male connector device, correspond a first setting of the first plurality of settings to a second setting of the second plurality of settings. The female connector device can also be configured to operate in a subsequent mode, in which it can permit coupling with at least one male connector device having the first setting and consistently deny access to at least one male connector device having a third setting different than the first setting.

Dynamic keying assembly

In an example, a process includes forming a patterned layer on a polymer substrate. The process also includes depositing a graphene-containing material on the patterned layer to form a plurality of graphene traces of a tamper detection circuit.

Tamper detection circuits

A computer system may determine a target position of the electronic component. The computer system may also determine a current position of the electronic component. The computer system may compare the current position to the target to position to determine whether the electronic component is in the target position. If the electronic component is not in the target position, the computer system may use an electroactive polymer to adjust the position of the electronic component to move the electronic component into the target position.

Dynamic position control for electronic components

In an example, a polymeric material is disclosed. The polymeric material includes a polymer substrate and a plurality of graphene traces arranged to form a tamper detection circuit on the polymer substrate.

A cable, system, and method for cooling a semiconductor chip on an active cable. The active cable includes a heat sink that is thermally coupled to the semiconductor chip and movable from a retracted position to an extended position. The heat sink is in the retracted position when the active cable is not installed in a card connector in a computer case. After the active cable is installed in the card connector, the heat sink is urged to the extended position in which the heat sink is exposed to air flow circulation within the computer case.

Active cable heat sink

Disclosed is a shape memory polymer (SMP) thermal interface material. The shape memory polymer may include a SMP matrix. The SMP matrix may include a liquid crystal elastomer. The SMP material may also include a thermally conductive filler embedded within the SMP matrix. The thermally conductive filler may include one or more substantially aligned subcomponents.

Shape memory thermal interface materials

An apparatus can dynamically adjust, in a card edge connector including first and second positions, an opening configured to receive a printed-circuit card. The apparatus may also include a set of contacts configured to connect with a set of edges of the printed-circuit card in the second position. The apparatus may also include a set of electroactive polymers configured to adjust the set of contacts between the first position and the second position by changing thickness in response to voltages applied to electrodes positioned adjacent to opposing faces of the set of electroactive polymers. The set of electroactive polymers can also include an electroactive polymer configured to control a single contact of the set of contacts.

Adjusting an opening of a card edge connector using a set of electroactive polymers

Embodiments of the disclosure relate to an apparatus and method for mitigation of warping of assembly components when subject to a thermal event. An interface unit with a complementary coefficient of thermal expansion is embodied in the assembly. The interface unit is configured to be received by a connector joined to the assembly substrate. The interface unit has a coefficient of thermal expansion (CTE) that complements the CTE of the assembly components in order to maintain the connector in alignment with the substrate and enable the connector to expand or contract with the substrate when subject to the thermal event.

Growing community of inventors

Rochester, MN, United States of America

Mark David Plucinski