Hughes Electronics Corporation

Mark D Heal

John R Grebliunas

Arnold L Berman

Howard T Ozaki

A microwave probe for use with densely populated surface mount and hybrid microwave circuit assemblies includes a housing, a RF signal pin, and ground pins, wherein the pins extend outwardly from the housing. The pins are preferably individually spring-loaded contacts, and are oriented on the housing relative to each other so as to permit contact with a planar transmission line when the pins are perpendicular to the surface of the transmission line or circuit board.

Microwave probe for surface mount and hybrid assemblies

The output impedance matching network of a power amplifier module is improved by the addition of an intermediate set of bonding pads in close proximity to a power transistor in the power amplifier module. A tunable set of bond wires extend from the intermediate bonding pads to a transmission line that is coupled to the output of the power amplifier module. The tunable bond wires allow the inductance of the impedance matching network to be tuned and optimized.

Growing community of inventors

Redondo Beach, CA, United States of America

Mark D Heal