Aehr Test Systems, Inc.

Intel Corporation

Aeha Test Systems

Mark Charles Carbone

Donald Paul Richmond, Ii

Frank Otto Uher

Jovan Jovanovic

Scott E Lindsey

Kenneth W Deboe

Patrick M Shepherd

Thomas T Maenner

Long V Vu

Paul W Burke

James F Tomic

Jeffrey L Tyson

Doan D Cao

Juha Paavola

John William Andberg

Jeff Ku

Gustavo Fricke

Mikko Antero Makinen

Shantanu Dattatraya Kulkarni

Justin Michael Huttula

Columbia Mishra

Prakash Kurma Raju

Vivek Paranjape

Catharina Biber

Kathiravan D

Twan Sing Loo

Hari Shanker Thakur

Christopher M Moore

Ritu Bawa

Min Suet Lim

Je-Young Chang

Dong-Ho Han

Jaejin Lee

Prasanna Pichumani

Amit Kumar Jain

Daniel J Ragland

Mohamed A Abdelmoneum

Gavin Sung

Sameer Shekhar

Samarth Alva

Arnab Sen

Hua Yang

Todd L Smith

Jason A Mix

Kannan G Raja

Lance Lin

Gokul V Subramaniam

Jerrod Peterson

Jason Y Jiang

Baomin Liu

Xiyong Tian

Jia Yan Go

Ruander Cardenas

Jerzy Lobacz

Evan Piotr Kuklinski

Timo Huusari

Bala P Subramanya

Gerry Juan

Chin Kung Goh

Satyajit Siddharay Kamat

Kari Mansukoski

Nicholas R Weber

Khai Ern Ke See

Nehakausar Shaikh Ramjan Pinjari

Merwin M Brown

George Baoci Sun

Shih Wei Nien

Chun-Ting Liu

Javed Shaikh

Mikko Makinen

Nehakausar Pinjari

Sammi Wy Liu

Khal Ern See

Nagaraj K

Paul Karayacoubian

Sarah Shahraini

Joshua Linden Levy

Juha Tapani Paavola

A circuit board and vapor chamber are disclosed. Connectors couple the vapor chamber to a circuit board. The connectors extend from the bottom of the vapor chamber. The connectors fix the vapor chamber to the circuit board such that the bottom of the vapor chamber thermally couples to a heat source on the circuit board. The circuit board has a connector assembly that couples to the vapor chamber.

Thermal solution as an effective EMI shield

Particular embodiments described herein provide for an electronic device that can be configured to include a vapor chamber that includes ionized fluid and an adjustable polarization layer coupled to the vapor chamber. The adjustable polarization layer can be used to direct a flow of the ionized fluid in the vapor chamber towards one or more heat sources. In some examples, the ionized fluid is ionized water and the adjustable polarization layer is polyester (PET) film that includes a plurality of electrode stripes.

Vapor chamber with ionized fluid

An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

Cooling systems, cooling structures and electronic devices and methods for manufacturing or operating cooling systems, cooling structures and electronic devices

Disclosed embodiments are relate to heat transfer devices or heat exchangers for computing systems, and in particular, to heat pipes for improved thermal performance at a cold plate interface. A thermal exchange assembly includes a heat pipe (HP) directly coupled to a cold plate. The HP includes a window, which is a recessed or depressed portion of the HP. The window is attached to the cold plate at a window section of the cold plate. The cold plate is configured to be placed on a semiconductor device that generates heat during operation. The cold plate transfers the heat to the HP with less thermal resistance than existing HP solutions. Other embodiments may be described and/or claimed.

Heat pipe for improved thermal performance at cold plate interface

An apparatus is described for burn-in and/or functional testing of microelectronic circuits of unsingulated wafers. A large number of power, ground, and signal connections can be made to a large number of contacts on a wafer. The apparatus has a cartridge that allows for fanning-in of electric paths. A distribution board has a plurality of interfaces that are strategically positioned to provide a dense configuration. The interfaces are connected through flexible attachments to an array of first connector modules. Each one of the first connector modules can be independently connected to a respective one of a plurality of second connector modules, thereby reducing stresses on a frame of the apparatus. Further features include for example a piston that allows for tight control of forces exerted by terminals onto contacts of a wafer.

Apparatus for testing electronic devices

Personal computing device covers having stands are disclosed. A disclosed example apparatus includes a protective cover to at least partially cover a personal computing device. The cover includes a fixed panel to be thermally coupled to a chassis of the personal computing device to define a heatsink of the personal computing device, and a foldable panel to be rotatably coupled to the fixed panel via a hinge to support the personal computing device to stand at an angle from a surface.

Personal computing device covers having stands

Computer

Techniques and mechanisms for regulating a temperature of a resonator structure. In an embodiment, a thermoelectric cooler (TEC) is thermally coupled to a resonator which is proximate thereto. The resonator supports operation with an oscillator circuit, wherein a resonance characteristic of the resonator contributes to oscillations of a master clock signal, or other oscillatory signal, which is provided with the oscillator circuit. The TEC provides Peltier functionality to selectively perform either one of heating or cooling the resonator. In another embodiment, the TEC is configured to conduct heat which is transferred via a path between the TEC and the resonator, wherein the path omits any circuitry which is to perform operations which are synchronized based on the oscillatory signal.

Device, system, and method to regulate temperature of a resonator structure

Particular embodiments described herein provide for an electronic device that can be configured to include a vapor chamber and means of attachment for the vapor chamber. The vapor chamber can include one or more columns, where at least a portion of the columns include fiber braids and one or more wicks. At least one of the wicks can also include the fiber braids. The columns can be braised to a top plate or a bottom plate of the vapor chamber. The vapor chamber can be secured over a heat source using a vapor chamber securing means that can include spring arms. The spring arms can bend, flex, rotate, etc. to absorb some of the force when vapor chamber is secured over the heat source.

Vapor chamber and means of attachment

Particular embodiments described herein provide for an electronic device that can be configured to include a plurality of chiplets, a plurality of resources, a system thermal engine, and at least one processor. The at least one processor is configured to cause the system thermal engine to monitor the plurality of chiplets, where the plurality of chiplets are part of a multi-chip module, determine that a first chiplet from the plurality of chiplets has reached a threshold temperature, and reduce power to the first chiplet without reducing power to the other chiplets in the plurality of chiplets.

Per chiplet thermal control in a disaggregated multi-chiplet system

Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a radiation source on the substrate, a ground on the substrate, where the ground is located around the radiation source, and a heat spreader over the radiation source, where the heat spreader includes one or more ground coupling mechanisms that are in contact with the ground on the substrate. The one or more ground coupling mechanisms in contact with the ground on the substrate create a radiation shield that at least partially keeps radiation from the radiation source from extending past the substrate.

Radiation shield around a component on a substrate

Particular embodiments described herein provide for an electronic device that can be configured to include a torsional heat pipe. The torsional heat pipe can include a first housing static portion located in a first housing of an electronic device, where the first housing static portion is coupled to a heat source, a second housing static portion located in a second housing of the electronic device, where the second housing static portion is coupled to a heat spreader, and a torsion portion located in a hinge of the electronic device, where the hinge rotatably couples the first housing to the second housing and the torsion portion rotates as the second housing rotates relative to the first housing and the torsion portion couples the first housing static portion to the second housing static portion.

Torsional heat pipe

Growing community of inventors

Mountain View, CA, United States of America

Mark Charles Carbone