Qualcomm Incorporated

Mark C Chan

Shiqun Gu

Matthew Michael Nowak

Michael Laisne

Hongjun Yao

Glen T Kim

An integrated circuit product package configured to continuity testing is described. The integrated circuit product package includes a package substrate. The package substrate includes internal routing connections. The integrated circuit product package also includes a semiconductor die coupled to the package substrate. The semiconductor die includes input/output (I/O) pins and switches. The switches selectively coupled the I/O pins to facilitate a daisy chain connection. The daisy chain connection includes circuitry fabricated on the semiconductor die, more than two of the internal routing connections, more than two of the I/O pins and at least one switch.

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San Diego, CA, United States of America

Mark C Chan