Cytec Industries Inc.

Cytec Technology Corporation

National Starch and Chemical Investment Holding Corporation

Mark Bonneau

Stephen J Howard

Jack D Boyd

Emiliano Frulloni

Scott D Lucas

Spencer Donald Jacobs

Gordon T Emmerson

Carmelo Luca Restuccia

Fiorenzo Lenzi

James Martin Griffin

Josanlet Villegas

Osama M Musa

Gordon Emmerson

Nikola A Nikolic

Vincent Aerts

Judith Anne Elder

Yun Kil Shin

Claude Billaud

Martin Sobczak

Gina Hoang

Colin McLean

Leon Dyers, Jr

Vincent Jjg Aerts

Vincent JJG Aerts

James Griffin

Thermoset resin composite materials comprising inter-laminar toughening particles

A curable composite material having high z-direction electrical conductivity. The curable composite material includes two or more layers of reinforcement carbon fibers that have been infused or impregnated with a curable matrix resin and an interlaminar region containing at least conductive nano-sized particles, e.g. carbon nanotubes, and a light-weight carbon veil. According to another embodiment, the interlaminar region further contains polymeric toughening particles. Methods for fabricating composite materials and structures are also disclosed.

Composite materials with high Z-direction electrical conductivity

A curable resin composition capable of providing good OHC performance at elevated temperatures when used in polymer matrix composites. This resin composition includes, as major components, one or more multifunctional benzoxazine compounds and cycloaliphatic epoxy resin.

Curable compositions containing benzoxazine epoxy blend and use thereof

A curable, epoxy-based resin composition that can be combined with reinforcement fibers and then cured to form a cured product that is excellent in toughness and exhibits high Open-Hole Tensile (OHT) strength. According to one embodiment, the resin composition contains a Bisphenol F difunctional epoxy, an anthracyl compound, a tri-functional epoxy, a thermoplastic polymer, and an amine-containing curing agent.

Epoxy-based resin composition for composite materials

Particle toughened, fiber-reinforced composites include a fiber region and an interlayer region between the fibers. The fiber region includes a plurality of fibers at least partially within a first polymer composition including a first base polymer formulation and a first plurality of toughening particles. The interlayer region includes a second polymer composition including a second base polymer formulation and at least one of the first plurality of toughening particles and a second plurality of toughening particles. Examples of first and second pluralities of toughening particles, respectively, may include core shell rubbers and polyimides. Increasing concentration of the first plurality of toughening particles may improve the composite toughness while preserving thermal properties of the composite, such as weight loss after extended duration exposure to elevated temperature. It is further discovered that the relative placement of the toughening particles influences composite mechanical properties, such as compression after impact (CAI) strength.

Particle-toughened fiber-reinforced polymer composites

Particle-toughened polymer compositions include a base polymer formulation and a plurality of toughening particles. In certain embodiments, the base polymer formulation includes bismaleimides or other polymer resins capable of high temperature service. A first plurality of toughening particles may include core shell rubbers. A second plurality of toughening particles may be selected from a variety of polymer compositions, including polyimides, polyether ketone (PEK), polyether ether ketone (PEEK), polyether ketone ketone (PEKK), polyether imide, polyether sulfones, and polyphenylene oxide. It is found that increasing concentration of the core shell rubbers may improve the toughness of the composition while preserving thermal properties of the composition, such as glass transition temperature.

Particle-toughened polymer compositions

Adhesive compositions containing a base compound or resin and an epoxy compound or resin with allyl or vinyl functionality show enhanced adhesive strength. The compositions can be used in microelectronic applications.

Die attach adhesives with epoxy compound or resin having allyl or vinyl groups

An adhesion promoter containing silane, and carbamate, thiocarbamate or urea functionality, and electron donor or electron acceptor functionality, displays low volatility.

Adhesion promoters containing silane, carbamate or urea, and donor or acceptor functionality

Growing community of inventors

Brea, CA, United States of America

Mark Bonneau