At+t Corp.

At&t Bell Laboratories

Mark B Cholewa

John William Osenbach

Lawrence Arnold Greenberg

Bryan P Segner

Lee H Fisher

A method of fabricating a semiconductor electro-optical device in which a cleaving apparatus is used to separate the wafer into bars of semiconductor material by striking the wafer from the epitaxial side, directly beneath the substrate side scribe mark. A series of angularly shaped trenches are etched across the epitaxial side of the semiconductor bars to permit bar separation into individual devices that allows a plurality of bars to be processed simultaneously.

Method of fabrication for electro-optical devices

A method is disclosed for processing an optical fiber to include an integral lens and a metallized outer coating. The fiber is first etched to include a tapered transition region and a thinned end region. The etched fiber is subsequently metallized and covered with a protective coating. A wet chemical etching technique is used to form an integral lens over the endface of the fiber. The protective coating is then stripped and any free metal is removed. The method allows for the fiber metallization to be in relative close proximity to the lens such that the fiber may be soldered into place near its endface, limiting any subsequent movement of the fiber relative to the aligned optical device.

Growing community of inventors

Mt. Penn, PA, United States of America

Mark B Cholewa