Aviza Technology Limited

Aviza Technologies, Inc.

Mark Ashley Ford

Rajkumar Jakkaraju

Paul Rich

A method of sputtering with sputtering apparatus is for depositing a layer upon a substrate. The apparatus includes a sputter target with a face exposed to the substrate and a magnetron providing a magnetic field that moves relative to the target face. The speed of movement of the field is controlled such that the uniformity of the deposition on the substrate is enhanced. A particular method includes monitoring uniformity verses speed, selecting the speed that gives the preferred uniformity and controlling the field to the selected speed. The selected speed may vary over the life of the target, with increased speeds becoming desirable as the target thins.

Methods and apparatus for sputtering

This invention relates to methods of depositing piezoelectric films such as in part of a stack including depositing a piezoelectric layer, measuring the thickness of the layer and depositing a further film or films such that the combined thickness is substantially equal to the target thickness.

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Bristol, United Kingdom

Mark Ashley Ford